-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
The Five Most-read Design007 Articles of 2022
December 27, 2022 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
Each December, we like to look back at the most popular articles of the past 12 months. You never know which article is going to blow up like a Blake Shelton album.
So, put on your ugliest holiday sweater and prop up that iPad. For your holiday enjoyment, here’s a blast from the past: the top five most-read Design007 articles of 2022.
Ventec’s Book on Thermal Management: The Summer Sequel You’ve Been Waiting For
The I-Connect007 eBooks have been moving like hotcakes, and Ventec’s 2022 offering got a lot of eyeballs on the page. Co-written by Ventec’s Didier Mauve and Robert Art, The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrate, Volume 2 was the second in the series, and PCB designers snapped it up. This article about the book launch was the most-read Design007 article of the year.
High-Voltage Circuit Design Guidelines and Materials
More of our readers seem to be entering the high-voltage arena lately, and this article by Celso Faia and Davi Correia of Cadence Design Systems rode a voltage spike into our top five. As they point out, a lot of high-voltage issues can be precluded early in the design cycle—if you know what you’re doing. Check it out.
Flexible Hybrid Electronics Design: Reducing Time to Market
Flex and rigid-flex design has been a hot topic for a few years, and Sean Nachnani’s article on flexible hybrid design flexed its biceps all the way into our five most-read items. NextFlex is leading much of the research in this space, and they’ve published a variety of articles this year. As we’ve seen, many of our readers are being forced into flex for one reason or another, and flex hybrids are making inroads into this segment now.
Kris Moyer Discusses New IPC Role
There’s an old saying in business-to-business publishing: People like reading about other people, and it shows. Our interview with IPC design instructor Kris Moyer was the most popular PCB design interview of 2022. More young people are entering this segment, and designers and design engineers are yearning for cutting-edge design education.
Altium Focusing on Educating Designers of Today and Tomorrow
Altium has been working with the educational community for years, providing EDA software to universities and holding educational events such as AltiumLive and Altium Education. This interview with Altium VP of Education Rea Callender and consultant Zach Peterson shot up into our most-read earlier this year. Education may be the hottest of the hot topics in PCB design now.
Suggested Items
Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
05/01/2024 | Real Time with...IPC APEX EXPOChris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.
IPC's Vision for Empowering PCB Design Engineers
04/30/2024 | Robert Erickson, IPCAs architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.