-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Indium Corporation Announces Updates to its Technical Service Team
December 29, 2022 | Indium CorporationEstimated reading time: 2 minutes
Indium Corporation® is pleased to announce several updates and additions to its technical service team. Adam Murling has been promoted to Technical Services Manager – USA and Sam Lytwynec has been promoted to the role of Technical Support Engineer II. Carson Burt and Joshua Dobransky have both assumed roles as technical support engineers.
In his new role, Murling leads the Americas Technical Service team. This includes hiring, training, coaching, and managing the team to realize its full potential. He also supervises the team’s project work to ensure exceptional technical excellence is delivered to Indium Corporation’s current and prospective customers.
Murling joined Indium Corporation in 2014 as a Technical Support Engineer. During his time with the company, he has authored multiple tech papers and published several blog posts. He was a recipient of the 2018 Silver Quill Honorable Mention Award and the 2020 Silver Quill Best Paper Award. He was also the moderator for Indium Corporation’s inaugural InSIDER Series webinar. Murling received his bachelor’s degree in chemical engineering from Clarkson University. He also completed Clarkson University’s Master of Science in Engineering Management (MSEM) Program, a rigorous, two-and-a-half-year curriculum, while working full-time at Indium Corporation.
Lytwynec has been promoted to Technical Support Engineer II after serving as Technical Support Engineer since 2021. In his new role, he continues to provide leading-edge technical support to Indium Corporation’s customers and potential customers in the Northwest North America region. He is responsible for resolving complex solder process challenges and will have a more direct role in project-related activities.
Lytwynec joined Indium Corporation in 2019 as an R&D Research Associate. In this role, he assisted with lab processes and the development of improved approaches to procedure, chemistry, and experiment design, including work on Indium Corporation’s highly successful DurafuseTM alloy family. He earned a bachelor’s degree in mechanical engineering technology from the State University of New York Polytechnic Institute.
As technical support engineers, Burt and Dobransky both assume responsibility for providing customers technical assistance to resolve soldering process-related issues. This includes assisting customers with optimizing their use of Indium Corporation’s soldering materials, and providing product and process training.
Burt was introduced to Indium Corporation as the Analytical Lab college intern in 2015. He then spent four years as an analytical chemist before rejoining Indium Corporation as an analytical technician. In this role, he was responsible for the calibration and standardization of instruments, interpreting data, and training other technicians. He earned a bachelor’s degree in chemistry from Clarkson University.
Dobransky served as the Engineered Solder Materials (ESM) college intern in 2021. In this role, he was responsible for assessing ESM and thermal interface materials for electric vehicle platforms and other new technology areas. He earned a bachelor’s degree in chemical engineering from Rensselaer Polytechnic Institute, graduating with cum laude honors.
From left to right: Adam Murling, Technical Services Manager – USA; Sam Lytwynec, Technical Support Engineer II; Carson Burt, Technical Support Engineer; Josh Dobransky, Technical Support Engineer
Suggested Items
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.