-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Nano Dimension Announces Fraunhofer Institute Purchase of DragonFly IV System
March 27, 2023 | Nano Dimension Ltd.Estimated reading time: 1 minute
Nano Dimension Ltd, a leading supplier of Additively Manufactured Electronics (AME) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (AM) 3D printers, announced that it received a purchase order for its newest AME system, the DragonFly IV, from the Fraunhofer-Gesellschaft, a leading German research institution.
The sale is the result of a strategic relationship between Nano Dimension and the Fraunhofer Research Institution for Individualized and Cell-Based Medical Engineering (Fraunhofer IMTE), which is one of the many groups in Fraunhofer-Gesellschaft. This sale will send the Company’s most advanced AME system to the Fraunhofer IMTE, which intends to use it for research and development projects in the field of medical electronics and instrumentation.
The Fraunhofer-Gesellschaft, based in Germany, is the world’s leading applied research organization. Prioritizing key future-relevant technologies and commercializing its findings for business and industry, it plays a major role in the innovation process. Founded in 1949, the Fraunhofer-Gesellschaft currently operates 76 institutes and research units throughout Germany. Over 30,000 employees, predominantly scientists and engineers, work with an annual research budget of €2.9 billion (approximately $3.1 billion).
The DragonFly® IV system is the ideal technology for Fraunhofer IMTE use cases. It enables specialty applications for High-Performance-Electronic-Devices (Hi-PEDs®) by simultaneously depositing proprietary conductive and dielectric substances, while integrating in-situ capacitors, antennas, coils, transformers, and electromechanical components. Such Hi-PEDs® are critical enablers for a range of applications, including autonomous intelligent drones, cars, satellites, smartphones, and in vivo medical devices. In addition, these products enable iterative development, IP safety, fast time-to-market, and device performance gains.
Professor Matthias Gräser, Department Head Diagnostics at Fraunhofer IMTE, shared, “We are pleased to work with Nano Dimension, given how their 3D printer for electronics, the DragonFly® IV, will enable us to design and manufacture electrical components that will complete our platform for Medical 3D-Printing and drive our research and development work forward. With a system such as Nano Dimension’s we can overcome design limitations and optimize development processes in terms of time and costs.”
Suggested Items
Merlin Flex invests in New Schmoll Direct Imaging System
04/30/2024 | Merlin Flex LtdMerlin Flex has fully installed and commissioned its 2nd Schmoll MDI Direct Imaging system. This new machine includes a twin bed, 4 head system which enhances Merlin Flex’s direct imaging capability for its 1.4M long flexible circuits.
Latest Test and Inspection Solutions from GOEPEL electronic at SMTconnect 2024
04/29/2024 | GOEPEL electronicGOEPEL electronic will be demonstrating automated test and inspection equipment at SMTconnect, taking place in Nuremberg from June 11 to 13, 2024.
TSMC Celebrates 30th North America Technology Symposium
04/29/2024 | TSMCTSMC unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.
QinetiQ Achieves UK’s First Jet-to-Jet Teaming Between Aircraft and Autonomous Drone
04/29/2024 | QinetiQQinetiQ has successfully trialled the UK’s first Crewed-Uncrewed-Teaming demonstration between a crewed aircraft and an autonomous jet drone.
Lockheed Martin Australia, The Department Of Defence Sign Strategic Partnership Head Contract
04/26/2024 | Lockheed MartinLockheed Martin Australia signed a landmark AUD$500 million contract with the Department of Defence to build Australia’s future Joint Air Battle Management System under project - AIR6500 Phase 1 (AIR6500-1).