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What is Ultra HDI?
September 22, 2023 | Happy Holden, I-Connect007Estimated reading time: Less than a minute
Ever since high-density interconnect (HDI) was created in 1982 by Hewlett-Packard to package its first 32-bit computer powered by a single chip, it has continued to evolve and provide the solutions for miniaturized products. The leading edge of HDI technology became the process used for organic flip-chip packaging for the semiconductor industry. The two distinct markets—IC substrates and product-system integration—are now colliding and utilizing the same ultra-HDI manufacturing processes (Figure 1).
Introduction
These two markets have different characteristics as well as specifications. The middle ground is currently occupied by the very high-density PCBs called substrate-like PCBs (SLPs).
The differences lie in that IC packaging is for components of unspecified final application while an HDI PCB is the result of a system-integrated product. But time and evolution have introduced a semiconductor component system integration strategy which the IEEE now calls heterogeneous integration.
Reference:
- Inspired by IEEE Heterogeneous Integration Roadmap, Chapter 2, pp 10.
Continue reading this article in the September 2023 issue of PCB007 Magazine.
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USPAE to Springboard U.S. Technology Forward
04/30/2024 | Marcy LaRont, PCB007 MagazineThe U.S. Partnership for Assured Electronics (USPAE) was launched as a nonprofit subsidiary of IPC in 2020, specifically to manage the DoD relationship and access to funding, and to develop a cooperative facility to develop UHDI capabilities in the U.S., not only for the defense sector, but for the whole of the U.S. electronics industry. It is a tall order, but industry veteran Joe O'Neil believes it will happen. Having been tasked with making the UHDI Capable Cooperative Production Facility (UCCPF) a reality, he provides an update on this important project for U.S. electronics manufacturing.
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Creators of SMT UHDI Test Board Vehicle Discuss this Important Project
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Collaboration and Innovation: Insights from SMTA's First UHDI Symposium
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SMTA Conducts First UHDI Symposium
03/29/2024 | Marcy LaRont, PCB007 MagazineSMTA’s first UHDI Symposium in Peoria, Arizona, on Tuesday, March 26 featured a standout full-day technical program with 11 separate presentations on what will be required for our companies to move to ultra HDI manufacturing. The event was the brainchild of Tara Dunn, SMTA director of training and education. It included a compelling and collaborative presentation by David Haboud of Altium, John Johnson of American Standards Circuits, and Chrys Shea of Shea Engineering, who had spent the past several weeks creating and building an appropriate SMT test board vehicle for UHDI, something that was passed around for all conference goers to see and touch.