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Lenthor Engineering, a California based designer, manufacturer and assembler of RIGID-FLEX and FLEX printed circuit boards, announces its 2016 year end financial results.
Total revenue for the full year 2016 came in at $27.1M compared to $19.9M in 2015 a 37% increase. Strong performance was reported for Q4 2016 with revenue totaling $6.4M compared to Q4 2015 results of $6.2M representing a 3% increase. Profit totals for both Q4 2016 and full year 2016 also reported in as strong reflected full year revenue results.
Lenthor Engineering continues funding of its business expansion plans with capital expenditures in 2017 planned for $2.2M. As part of that plan Lenthor has expended $1M to date in its Assembly and Fabrication area. The expenditures in Assembly which include both Solder Paste AOI and Component AOI provide Lenthor’s customers with the level of quality assurance necessary in today’s demanding and competitive marketplace.
Patty Goldman, I-Connect007
While walking around the PCB hall at productronica, I was approached by my good friend Gene Weiner. Gene emphatically directed me to the Elga booth to find out about their new extra-thick dry film that can image extremely fine features with a perfectly perpendicular sidewall. Elga Europe CEO Giorgio Favini filled me in on the details.
Barry Matties, I-Connect007
With the recent planned acquisition of Orbotech in place by maker KLA-Tencor, much of the industry has speculated about Orbotech’s future. Barry Matties spoke with CEO Asher Levy about what lies in store for the Orbotech group and, more specifically, their PCB division should the deal close.
Jan Pedersen, ELMATICA
IPC’s Automotive Addendum task group was started in November 2014 and the first edition of IPC 6012-DA was released in April 2016. We are now working on the revised version, and expect a release in Q2 2018. As standards need to evolve, develop and follow the needs of the industry, this work is continuous.