RTW IPC APEX: HDPUG's Jack Fisher Discusses Updates on Optoelectronics Project


Reading time ( words)

Conventional copper electronic interconnect faces fundamental obstacles that prevent it from meeting increasing bandwidth demands. Optical PCB technology had been researched for several years, but significant issues remain before it can be commercialized. The HDPUG Optoelectronics project set out to demonstrate that optical waveguides incorporated within a backplane could benefit the system's interconnect topology. HDPUG facilitator Jack Fisher explains that a demonstrator has now been built and is currently under test at a number of leading OEMs.
 

Share


Suggested Items

Unimicron Germany Rises from the Ashes with New Smart Factory

04/30/2018 | Pete Starkey, I-Connect007 and Michael Weinhold, EIPC
This is a review of the grand opening of Unimicron’s new smart factory in Geldern, Germany. A fire in a PCB shop is an experience we all dread, but still it happens, and the consequences can be devastating. In the early hours of December 28, 2016, the innerlayer production plant at RUWEL International in Geldern, Germany, caught fire and the whole factory and its contents were destroyed.

Elga Europe Reality and Ultra-High-Resolution Photoresist

04/24/2018 | Patty Goldman, I-Connect007
While walking around the PCB hall at productronica, I was approached by my good friend Gene Weiner. Gene emphatically directed me to the Elga booth to find out about their new extra-thick dry film that can image extremely fine features with a perfectly perpendicular sidewall. Elga Europe CEO Giorgio Favini filled me in on the details.

The Vast Offerings in Laminate Technologies from TUC

04/10/2018 | Patty Goldman, I-Connect007
While at IPC APEX EXPO a few weeks ago, I sat down with George Hsin, chief strategy officer for TUC Worldwide, and Alan Cochrane, president of TUC North America. I was interested in learning more about the company and their laminate products and Alan was happy to fill me in.



Copyright © 2018 I-Connect007. All rights reserved.