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Conventional copper electronic interconnect faces fundamental obstacles that prevent it from meeting increasing bandwidth demands. Optical PCB technology had been researched for several years, but significant issues remain before it can be commercialized. The HDPUG Optoelectronics project set out to demonstrate that optical waveguides incorporated within a backplane could benefit the system's interconnect topology. HDPUG facilitator Jack Fisher explains that a demonstrator has now been built and is currently under test at a number of leading OEMs.
01/27/2021 | I-Connect007 Editorial Team
We recently spoke to Ed Carignan of Technica, who outlines the current landscape for both direct imaging and inkjet printing and describes how the technologies have evolved over the years. He also details what’s next on the horizon.
10/02/2020 | Nolan Johnson, I-Connect007
Most all the action this week involved the STMA International Conference and Exposition. I-Connect007’s Real Time with… video interviews generally led the way for views and clicks. In each item, the intent was to make things better in some fashion. Whether it was pivoting on trade show delivery, optimizing the metalization process in the fab, adding more AI to manufacturing capital equipment, unifying and furthering the concept of the digital twin concept, or responding to company growth by upgrading systems with the help the equipment manufacturers, all these news items speak to being adaptable and forward-thinking.
08/19/2020 | I-Connect007 Editorial Team
Jim Metropoulos, CEO and founder of Blue Box, talks about the innovative foam solution he developed to clean the coils of HVAC systems in large facilities, ranging from casinos and manufacturing plants to some of the top hospitals in the country.