Orbotech to Supply Unimicron with Industry 4.0-compliant DI, AOI and AOS PCB Production Solutions


Reading time ( words)

Orbotech Ltd. today announced a multi-million-dollar agreement with Unimicron Germany GmbH (formerly RUWEL International) for the purchase of Orbotech’s direct imaging (DI), automated optical inspection (AOI) and automated optical shaping (AOS) PCB production solutions. Unimicron Germany is in the process of rebuilding its inner layer fab as a fully automated Industry 4.0, state-of-the-art facility, and upgrading its Outerlayer and Solder Mask capacity and capabilities.

Unimicron Germany GmbH specializes in high-end, high-reliability manufacturing for automotive electronics, renewable energy and industrial markets. The site is expected to be fully functional in the first half of 2018.

Among the Orbotech solutions Unimicron Germany has ordered are the latest members of the Nuvogo family for direct imaging; Orbotech Diamond 8 for high throughput solder mask direct imaging; Fusion 22 AOI with 2D metrology in process quality control (IPQC); Precise 800 AOS system for 3D shaping of any layer HDI and complex multi-layer boards; and Orbotech Smart Factory for Industry 4.0-compliant, integrated PCB production.

“Following the fire which devastated our facility last year, we have a unique opportunity to rebuild and improve on our past successes,” said Mr. Gerard van Dierendonck, CEO of Unimicron Germany. “We are committed to making the facility more environmentally and energy friendly, as well as ensuring the highest level of flexibility with the lowest total cost of ownership. We selected Orbotech’s solutions because they enable us to achieve our goals and are the best fit for our customers’ present and anticipated production and technology needs.”

“We are delighted to be able to provide a wide range of PCB production solutions as part of Unimicron Germany’s rebuilding project and to further deepen our relationship,” stated Mr. Sharon Cohen, President of Orbotech West. “Our Industry 4.0-compliant solutions meet Unimicron’s specific advanced technology and reliability needs and enable and ensures traceability, which is critical for automotive and other high-reliability PCB applications. In addition, our comprehensive customer service offering, with our one-stop monitoring center, is designed to provide pro-active, preventative measures which can troubleshoot any potential issues, such as downtime, before they even occur.”

“Orbotech’s solutions are a perfect fit for our strategy moving forward and our aim of building the most modern inner layer factory possible,” said Mr. Rico Schlüter, CTO of Unimicron Germany. “As the European PCB industry continues to make significant changes, we are determined to invest in state-of-the-art equipment that will grow with us.”

About Unimicron Germany GmbH

Unimicron Germany (formerly known as RUWEL International GmbH) is part of the Unimicron Technology Corporation, and is one of the most important producers of circuit boards in Europe. Unimicron Germany has production capacity in both Europe and Asia managed by one team of highly dedicated professionals based in Germany. Unimicron Germany’s maxim is to be a technology trendsetter with innovations to set the pace for technical progress. The company aims to help clients to optimize their PCB designs, provide rapid prototyping and sample production and place particular focus on producing small to medium volumes of highly complex PCBs. By continuously transferring process know-how and technology within the High Reliability Business Unit (HRBU), high volume clients are served equally well, while getting great value from the lower cost base in Asia. For more information, click here.

About Orbotech Ltd

Orbotech Ltd. is a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products. Orbotech provides cutting-edge solutions for use in the manufacture of printed circuit boards (PCBs), flat panel displays (FPDs), and semiconductor devices (SDs), designed to enable the production of innovative, next-generation electronic products and improve the cost effectiveness of existing and future electronics production processes. Orbotech’s core business lies in enabling electronic device manufacturers to inspect and understand PCBs and FPDs and to verify their quality (‘reading’); pattern the desired electronic circuitry on the relevant substrate and perform three dimensional shaping of metalized circuits on multiple surfaces (‘writing’); and utilize advanced vacuum deposition and etching processes in SD and semiconductor manufacturing (‘connecting’). Orbotech refers to this ‘reading’, ‘writing’ and ‘connecting’ as enabling the ‘Language of Electronics’. For more information, click here.

Share




Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/13/2022 | Nolan Johnson, I-Connect007
The big news in the industry this week was the new bill introduced to the U.S. Congress in support of the PCB manufacturing industry. The Supporting American Printed Circuit Boards Act of 2022, which was introduced by Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT), incentivizes “purchases of domestically produced PCBs as well as industry investments in factories, equipment, workforce training, and research and development.” The bill is a PCB-oriented complement to the semiconductor-oriented CHIPS Act of 2021.

Improved Thermal Interface Materials For Cooling High-Power Electronics

03/31/2022 | Jeff Brandman, Aismalibar North America
Heat has been a significant concern in electronics since the beginning of the electronics age when hot glowing vacuum tubes were first used to receive and transmit data bits. The transistor and integrated circuit effectively solved that basic problem, but increases in integration resulted in increased concentration of heat, exacerbated by relentless increases in operating frequency. While improvements in electronics technology have been able to mitigate many thermal issues at chip level thanks to improved semiconductor designs devised to operate at lower voltages (thus requiring less energy) the thermal management challenge continues to vex electronic product developers.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/25/2022 | Andy Shaughnessy, Design007 Magazine
It’s been a crazy week, with lots of bad news coming out of Ukraine. (I’m a news junkie by trade, but I confess that some days I just unplug from the news completely to avoid overdosing on negativity.) And, as you might have guessed, this is all having ill effects on our electronics supply chain, which is already stretched thin. This is reflected in our IPC news item that shows an uptick in PCB sales in February, but a drop in bookings YOY, in part due to the trouble in Eastern Europe. But there’s positive news in this week’s top reads. We have a NextFlex article about an innovative flexible technology called flexible hybrid electronics (FHE) and a great interview by Dan Beaulieu. We also have a column by Travis Kelly, who discusses PCBAA’s efforts to lobby for American manufacturing in Washington. And last but not least, let’s welcome our two newest columnists, Paige Fiet and Hannah Nelson, who discuss their excitement about entering this industry.



Copyright © 2022 I-Connect007. All rights reserved.