EIPC SpeedNews: News from the European PCB Industry


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News from EIPC

- EIPC Member's Job Vacancies

News from Germany

- Atotech Presents Study Results of Pd Initiation in ENEPIG at the InterPACK 2017

- FED Conference September 21–22

Electronics Industry News

- Smartphone Growth Expected to Remain Positive as Shipments Forecast to Grow to $1.7B in 2021

News from the UK

- Reliability and Process Trouble Shooting with SMART Group Events

- ICT Evening Seminar, Newtown House Hotel, Hayling Island, September 19

News from the US

- Ventec Highlights Advanced Thermal Management Solutions at Electric & Hybrid Vehicle Technology Expo

News from WECC Members

Click here for the International Events Diary 2017 

Click here to download the complete SpeedNews Issue 27

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Suggested Items

EIPC 50th Anniversary Conference Day 1: The Past, the Present and the Future, Pt. 1

07/13/2018 | Pete Starkey, I-Connect007
Just like old times—meeting with John Ling, with whom I had previously travelled to industry events for over two decades, and who still carries the role of EIPC marketing manager, to fly together from Birmingham UK to Dusseldorf in Germany for the EIPC 50th Anniversary Summer Conference.

Bridging Knowledge and Understanding of Thermal Management Materials

03/14/2018 | Pete Starkey, I-Connect007
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.

RTW IPC APEX EXPO: Ventec's Jack Pattie on New Materials, Industry Upswing

03/13/2018 | Real Time with...IPC
Ventec International Group’s Jack Pattie comments on continuing growth in sales, investment in manufacturing and distribution, and new product developments in polyimides, no-flow pre-pregs and thermally conductive materials.



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