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The October issue of The PCB Magazine has published and is now available.
Current Trends in Signal Integrity
If you think signal integrity is just a design problem, think again. As board features get smaller, as speeds get faster, and as more is expected from everyone in the supply chain, signal integrity should have everyone’s attention. This month, our experts explain why.
Check it all out this month in The PCB Magazine, now on the virtual newsstand and available for delivery in your e-mailbox each month by subscribing here.
You can also download the pdf version to your devices for future reference.
John (Josse) Steinar Johnsen, ELMATICA
Knowledge and experience are the two key elements when planning a PCB. Today’s PCB designers must have far more knowledge and understanding of the PCB production process than in the past. This is especially important when they plan and how they plan the stackup, via span, routing and power distribution.
Happy Holden, I-Connect007
The increasingly widespread use of finepitch ball-grid array (BGA), chip scale packaging (CSP), and other evolving technology form-factors means that new fabrication techniques must be used to create printed circuit boards (PCBs).
Real Time with...IPC
The HDPUG High-Frequency Flex project is studying the effect of different design features, specifically cross hatched ground planes, on signal integrity for flexible printed circuit boards operating at frequencies up to 20 GHz. Jonathan Weldon, RF Applications Engineer at DuPont Electronic Materials, discusses some of the results of the program.