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The National Physical Laboratory and SMART Group will hold a seminar November 9, 2017, that will showcase the latest research and results from NPL projects looking at solder joint and contamination failure, coating thickness measurement, solder joint reliability, and high temperature reliability for alternative solders and substrates materials.
Presentations include performance and lifetime of printed semiconductors, high-temperature electronics and their reliability, coatings for high temperature applications, and factors affecting moisture diffusion in PCBs.
The event will be held at the National Physical Laboratory in Hampton Road, Teddington in London.
To register, click here.
After a long-term program of cooperative development, evaluation and qualification, Taiyo America’s solvent-free ink-jet solder mask formulation is working successfully in a technically demanding production environment. Don Monn recounts his experiences from the show floor at productronica 2017.
Andreas Lydersen, ELMATICA
As automation works its way onto the shop floors, it still struggles to replace humans in the supporting roles, such as designers, purchasers, brokers, and back-office staff. Where automation on the shop floor replaces humans in doing repetitive manual tasks, the supporting roles (at least some of them) require intelligence to understand and utilise information.
Patty Goldman, I-Connect007
I was introduced to liloTree and Chief Scientist Kunal Shah by Joe Fjelstad. It seems this small company (with Intel as part of its pedigree) has developed a novel ENIG process that just may shake up the regular chemistry suppliers. This new process is described as cost-effective and ecofriendly while completely eliminating black pad and brittle solder joints.