Reading time ( words)
The Institute of Circuit Technology (ICT) Evening Seminar, which will be held December 5, 2018 at the Majestic Hotel in Harrogate, UK, will feature Emma Hudson of UL, Andy Cobley of Coventry University, and Jean-Paul Birraux of First EIE (Geneva) as presenters.
Hudson will present on the topic of solder limits for recognized PCBs and materials. Cobley, meanwhile, will present on a new project, Selective Metallization of Dielectric Substrates Using a Magnetic Field.
Birraux, on the other hand, will give a presentation titled “Developments in Photo-plotters, UV Direct Imaging and Automatic Visual Inspection (AVI) Systems”.
For more information, click here.
Pete Starkey, I-Connect007
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.
Gene Weiner, Weiner International Inc.
IPC is planning to hold a special meeting on automotive electronics for senior executives during IPC APEX EXPO 2019. The meeting will be planned and produced by the IPC Ambassador Council. Its presentations will feature senior members of the entire automotive electronics supply chain.
Joel Schrauben, Cameron Tribe, Christopher Ryder and Jan Kleinert, ELECTRO SCIENTIFIC INDUSTRIES
This paper details a new methodology for the plating of conductive features onto glass dielectrics. A laser is used to ablate material from a glass substrate in the desired pattern, and copper is “seeded” into these features using laser-induced forward transfer of a copper foil.