EIPC SpeedNews: News from the European PCB Industry


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News from EIPC

- Program Available Now! EIPC Winter Conference Lyon 2018

- 50 Years of Service, a Century of Conferences, a Lifetime of Excellence

News from China

- Schweizer Sets Direction for Further Growth by Investing in China

- Advanced Electronics Needs Met in China

News from France

- Protecno Becomes the First French PCB Manufacturer to Invest in Orbotech's Nuvogo Direct Imaging Solution

News from productronica

- productronica Sets Standards in Electronics Production

News from the UK

- IPC Awards IPC-4101 Qualified Products Listing to Ventec International Group

- iMaps UK Conference

- Microtech 2018

- Advanced Packaging Conference: November 14–15, 2017 in Munich

- ICT Evening Seminar, December 5

- BGA, QFN Fine Pitch Rework Experience Live, November 21

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Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 2

06/15/2017 | Pete Starkey, I-Connect007
The second day saw the conference room full once more, the late networking session in the bar having resulted in no significant casualties, and I was pleased to accept the invitation to moderate the first session, on processes and materials for flexible PCBs.

A Conversation with Gene Weiner

03/30/2017 | Barry Matties and Patty Goldman, I-Connect007
In a discussion following the PCB Executive Forum at IPC APEX EXPO in February, Gene Weiner opened up to Barry Matties and Patty Goldman on the state of the North American electronics industry supply chain and the importance of cooperative efforts up and down that supply chain.

The Near and Far Future for Orbotech and Inspection

03/23/2017 | Barry Matties, I-Connect007
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