EIPC SpeedNews: News from the European PCB Industry

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News from EIPC

- Program Available Now! EIPC Winter Conference Lyon 2018

- 50 Years of Service, a Century of Conferences, a Lifetime of Excellence

News from China

- Schweizer Sets Direction for Further Growth by Investing in China

- Advanced Electronics Needs Met in China

News from France

- Protecno Becomes the First French PCB Manufacturer to Invest in Orbotech's Nuvogo Direct Imaging Solution

News from productronica

- productronica Sets Standards in Electronics Production

News from the UK

- IPC Awards IPC-4101 Qualified Products Listing to Ventec International Group

- iMaps UK Conference

- Microtech 2018

- Advanced Packaging Conference: November 14–15, 2017 in Munich

- ICT Evening Seminar, December 5

- BGA, QFN Fine Pitch Rework Experience Live, November 21


Suggested Items

Institute of Circuit Technology Meriden Seminar, 2018

03/21/2018 | Pete Starkey, I-Connect007
The Institute of Circuit Technology returned to Meriden, traditionally regarded as the centre of England, for its Annual General Meeting, which was followed by a technical seminar of five presentations, introduced as ever by Technical Director Bill Wilkie.

RTW IPC APEX EXPO: IPC—Industry Trends Moving Forward

03/20/2018 | Real Time with...IPC
Sharon Starr, director of market research for the IPC, discusses industry trends moving forward covering both EMS and PCB. She also mentions the upcoming studies IPC will be conducting in 2018.

Bridging Knowledge and Understanding of Thermal Management Materials

03/14/2018 | Pete Starkey, I-Connect007
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.

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