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The 2017 International Printed Circuit & APEX South China Fair (2017 HKPCA & IPC Show), to be held from December 6–8, 2017 at the Shenzhen Convention & Exhibition Center in Shenzhen, China, will feature leading industry experts sharing their insights on the latest market trends and innovations.
Topics to be discussed include advancing HDI technology, mobile intelligent telecommunications, PCB production for the automotive industry, smart manufacturing for PCB production, cleaning PCB / PCBA flux residual process, and conformal coating trends, among others.
Click here to view the full agenda.
02/26/2018 | Patty Goldman, I-Connect007
This month, we will discuss the equipment purchasing decision-making process. How many of you can recall the earliest “dippy dunk” PCB shops, so-called because that’s exactly how it was done? There were no conveyorized lines, no automatic hoists, no load/unload stations, maybe not even a lab for analyzing the plating baths.
02/20/2018 | Pete Starkey, I-Connect007
The first day of the conference had started and ended in the dark—a long and technically intense day! After a convivial conference dinner and a good night’s sleep we were back on the bus, this time in daylight at the slightly later time of 8:00 a.m., for the journey from downtown Lyon back to Alstom’s conference facility in Villeurbanne, and it wasn’t raining. In fact, there was even some sunshine later in the day!
12/08/2017 | Real Time with...HKPCA and IPC
Canice Chung, chairman of the HKPCA, speaks with Managing Editor Stephen Las Marias about the record-breaking show, held this week in Shenzhen, China.