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LaserVia Corporation has announced that it is putting its intellectual property portfolio up for sale.
The timing on this announcement fits well with the recent renewed interest and energy for the advancement of high density interconnects (HDI) which has increased the demand for improved laser drilled blind microvias; including z-axis interconnect using blind microvias. Potentially valuable interconnect advances include via-in-pad slots and other shapes instead of round holes allowing significant reductions in the footprint for surface mounted component pads.
Advances in laser drilling is further possible with a proposed laser drilling machine design that can drill both sides of a circuit board using an inline system for improved processing speeds resulting in lower cost:
The IP for sale includes the valuable US Patents 6,631,558 & 7,062,485.
For additional information please contact Dan Feinberg at Fein-Line Associates (949) 498-7866 firstname.lastname@example.org or Larry Burgess at Laservia (503) 446-7248 email@example.com.
Barry Matties, I-Connect007
Barry Matties met with Lino Sousa at productronica to check out Pluritec’s new Pluricut HPL machine, which offers an all-in-one solution for flash routing, beveling, measuring, and corner routing. See this machine in action by viewing the attached video content.
Gene Weiner, Weiner International Inc.
Hold on to your seats! 2018 will be a year full of rapid changes, surprises, and growth. M&A activities will flourish. The supply chain will suffer shortages and changes as demand increases, copycats will rush to market, and new markets and potential suppliers will vanish before they are established.
Patty Goldman, I-Connect007
There is no denying that high-density interconnect (HDI) has been around a long time—over 25 years, believe it or not. From almost the moment of its conception in the U.S., the technology was adopted by and used almost exclusively in Asia.