LaserVia Sells Intellectual Property Portfolio


Reading time ( words)

LaserVia Corporation has announced that it is putting its intellectual property portfolio up for sale.

The timing on this announcement fits well with the recent renewed interest and energy for the advancement of high density interconnects (HDI) which has increased the demand for improved laser drilled blind microvias; including z-axis interconnect using blind microvias. Potentially valuable interconnect advances include via-in-pad slots and other shapes instead of round holes allowing significant reductions in the footprint for surface mounted component pads.

laser1.jpg

Advances in laser drilling is further possible with a proposed laser drilling machine design that can drill both sides of a circuit board using an inline system for improved processing speeds resulting in lower cost:

laser2.jpg 

The IP for sale includes the valuable US Patents 6,631,558 & 7,062,485.

For additional information please contact Dan Feinberg at Fein-Line Associates (949) 498-7866 baer@feinline.com or Larry Burgess at Laservia (503) 446-7248 lwburgess@laservia.com.

Share

Print


Suggested Items

Photonics Systems Looks to Expand Its PCB Capabilities

06/17/2019 | Barry Matties, I-Connect007
Pulsed-laser equipment manufacturer Photonics Systems looks to expand its capabilities to the PCB industry. Barry Matties sat down with Antonio Schmidt and Kurt Weber to talk about the company’s transition and the challenges they’ve faced thus far as they continue to build and extend their brand into a new market segment.

PCB Fabricators’ Tech Capabilities Exceed OEMs’ Needs in Many Areas

06/06/2019 | Dennis Fritz, Fritz Consulting
Some interesting differences showed up in the board property data reported by the OEMs and PCB fabricators that participated in IPC’s PCB Technology Trends 2018 study.

RTW IPC APEX EXPO 2019: LPKF Highlights Laser Processing Tech, Glass Drilling Capabilities

02/11/2019 | Real Time with...IPC
Guest Editor Joe Fjelstad sits down with Stephan H. Schmidt, LPKF president, who provides an overview of the company's laser processing machine and their capabilities, and highlights the new glass drilling capabilities.



Copyright © 2019 I-Connect007. All rights reserved.