Reading time ( words)
LaserVia Corporation has announced that it is putting its intellectual property portfolio up for sale.
The timing on this announcement fits well with the recent renewed interest and energy for the advancement of high density interconnects (HDI) which has increased the demand for improved laser drilled blind microvias; including z-axis interconnect using blind microvias. Potentially valuable interconnect advances include via-in-pad slots and other shapes instead of round holes allowing significant reductions in the footprint for surface mounted component pads.
Advances in laser drilling is further possible with a proposed laser drilling machine design that can drill both sides of a circuit board using an inline system for improved processing speeds resulting in lower cost:
The IP for sale includes the valuable US Patents 6,631,558 & 7,062,485.
For additional information please contact Dan Feinberg at Fein-Line Associates (949) 498-7866 firstname.lastname@example.org or Larry Burgess at Laservia (503) 446-7248 email@example.com.
Thy-An Tran, Pioneer Circuits Inc.
The Mars2020 Rover Mission, designed by JPL, is the next NASA Mars Exploration Program mission that is planned to launch in 2020. Some goals of the mission include to check for past signs of life, to help prepare for manned Mars missions, and to collect soil samples of Mars back to Earth.
Barry Matties and Patty Goldman, I-Connect007
At productronica, Barry Matties, Andy Shaughnessy, and Patty Goldman of the 007 team sat down with Eduardo Benmayor, director general with Aismalibar, a laminate supplier currently focusing on thermal management for the LED and automotive markets.
Solder mask remains a relatively hands-on task, which can result in human error. But equipment manufacturer Pluritec wants to change that. At PCB West, I spoke with Pluritec Vice President of Sales Lino Sousa about the company’s new spray technology that can turn solder mask application into what is essentially a push-button operation.