MacDermid Enthone Electronics Solutions to Exhibit at 2018 IMAPS Device Packaging Show


Reading time ( words)

MacDermid Enthone Electronics Solutions (MEES), a global electronics chemicals supplier, will exhibit at the IMAPS Device Packaging show being held in Fountain Hills, Arizona, March 6-7, 2018.

MacDermid Enthone‘s Advanced Electronics Solutions (AES) business is a global leader in high performance semiconductor chemistries and assembly materials. OEMs, IDMs, wafer foundry engineers, tool suppliers, and OSATs should visit the IMAPS booth to collaboratively develop solutions that meet the fast paced semiconductor market demands. The AES team will highlight the MICROFAB family of products which provides advanced packaging solutions that exceed aggressive packaging design requirements and enable greater device reliability. MEES will showcase its chemical processes for IC substrates, including PackagePrep solderable finish for QFN sidewalls, and PackageBond leadframe adhesion promoter.

Eric Gongora, General Manager and Stretegic Marketing Director of Wafer Level Packaging, along with AES industry experts, will be available to discuss the challenges the semiconductor manufacturing sector faces as technology continues to push the limits of performance and miniaturization.

The booth will also include specialty product offerings from their sister company, Alpha Advanced Materials. The combined technology, experience and product offerings make them the new industry leader in all materials for Advanced Packaging.

For more information on our latest product technologies, visit us at Booth 45/46.

About MacDermid Enthone Electronics Solutions

MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there. For more information, click here.

Share

Print


Suggested Items

ICT 45th Annual Symposium Review

06/12/2019 | Pete Starkey, I-Connect007
The Institute of Circuit Technology (ICT) held its 45th annual symposium on June 4, 2019 in Dudley at the Black Country Museum—a symbol of the spirit of innovation in engineering technology and the entrepreneurial and manufacturing skills that had established that region’s supremacy in leading the original Industrial Revolution. Here's a recap of the events and presentations at the symposium.

IMPACT Washington, D.C. 2019 Recap: Leaders Call for Action on USMCA Trade Deal

05/30/2019 | Chris Mitchell, IPC VP, Global Government Relations
Top executives from electronics companies across the United States were in Washington, D.C., last week to call on the Trump administration and Congress to support policies that will drive the electronics industry’s future growth in North America and worldwide.

DuPont on New Beginnings and Empowering the Industry

05/21/2019 | I-Connect007 Editorial Team
Andy Kannurpatti gives the I-Connect007 team an overview of the latest news from DuPont Electronics and Imaging, including investments toward the new production assets in Ohio, Silicon Valley Technology Center, and other facilities. He also details how the company is engaging OEMs and PCB fabricators and design teams, as well as some exciting business updates coming this spring and summer.



Copyright © 2019 I-Connect007. All rights reserved.