Rogers Corporation Introduces RO4460G2 Bondply


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Rogers Corporation is pleased to introduce RO4460G2, a low loss bondply with a 6.15 dielectric constant (Dk). RO4000 thermoset high performance bonding layers have long been used by circuit designers for multilayer board constructions using Rogers high frequency and high speed digital materials where operating frequency, dielectric constant, or high-speed signal requirements dictate the need for high performance materials. The introduction of RO4460G2 bondply now provides designers a 0.004” (0.101 mm) bonding layer that complements the already released RO4360G2 low loss, glass-reinforced 6.15 Dk copper clad thermoset laminates.

RO4460G2 bondply exhibits excellent Dk control for repeatable electrical performance, a low z axis expansion for plated through hole reliability, and thermoset bond temperatures compatible with standard epoxy/glass (FR-4) processes. RO4460G2 bondply is an excellent choice for multilayer designs requiring sequential laminations, as fully cured RO4400 bondplies are capable of withstanding multiple lamination cycles. Each of the RO4400 bondplies have the UL V-0 flame retardant rating, and are compatible with lead-free processes.

About Rogers Corporation

Rogers Corporation is a global technology leader in engineered materials to power, protect, and connect our world.  With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, Internet connectivity, advanced transportation and other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification, and alternative energy; Elastomeric Material Solutions for sealing, vibration management, and impact protection in mobile devices, transportation interiors, and performance apparel; and Advanced Connectivity Solutions materials for wireless infrastructure, automotive safety and radar systems. Headquartered in Chandler, Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide. For more information, click here.

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