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IPC APEX EXPO 2018 is underway, and I-Connect007 is in San Diego bringing you complete coverage of this annual event. If you couldn't make it to the show, be sure to catch our video interviews with the movers and shakers of the electronics industry. We've updated our video presentation for a better experience for our users, check it out!
To watch our coverage of IPC APEX EXPO 2018, click here.
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Dan Gamota Discusses Flex and Alternative Substrates
03/14/2019 |
Patty Goldman and Andy Shaughnessy, I-Connect007
As the VP of manufacturing technology and innovation for Jabil, Dan gave us his take on the current state of flex and alternative substrates and explained why modeling, automation, and process controls are likely to be key ingredients in the recipe for manufacturing non-FR-4 boards in the future.
RTW IPC APEX EXPO 2019: Insulectro Sees Growth and Opportunities in Printed Electronics
03/11/2019 |
Real Time with...IPC
Judy Warner speaks with Tim Redfern, Insulectro president, and Kevin M. Miller, VP of sales, about growth in the printed electronics market, the direction Insulectro is going, and opportunities for North American PCB suppliers. They note that the company will increase their focus and investment in the printed electronics market.
Flex/MSTC Joint Conference: A Collaborative Week in Monterey
03/06/2019 |
Nolan Johnson, I-Connect007
Collaboration filled the air at the Hyatt Regency in Monterey, California, as the 18th annual Flex/Mems&Sensors technical conference brought flex technology and sensor experts and 550+ attendees together to network and share ideas from February 18–21, 2019.
