Rogers Introduces New Laminates for Base Station Antenna Applications


Reading time ( words)

Rogers Corporation has introduced two new products: AD300D laminates and IM Series laminates. AD300D fourth generation, commercial microwave and RF laminate material extends the capabilities of the successful AD300 product grade. 

This ceramic-filled, glass-reinforced, PTFE based material provides the controlled dielectric constant (2.94±0.05), low loss performance (0.0021 at 10GHz), very good passive intermodulation response (-159dBc at 0.030” thickness), and good circuit process ability required for mobile infrastructure microstrip antenna applications. This PTFE composite material combines a cost-effective construction with unique chemistry and processing to offer RF and microwave designers an option for improving electrical and mechanical performance without the additional costs traditionally associated with higher performance material options. 

The IM Series high-frequency laminates are an outstanding passive intermodulation (PIM) performing version of our AD300D, AD255C, and DiClad 880 antenna grade laminates. The laminates now include the newly developed IM system option. This product utilizes  an ultra-smooth (Rq = 0.5µm by non-contact interferometry method) electrodeposited copper foil option which has excellent adhesion to the substrate materials. The PIM performance of all substrates with the IM cladding has typical values of -166dBc at 0.030” and -165dBc at -060” using the Rogers internal test method of two 43 dBm swept tones at 1900 MHz. These specialty materials are specifically engineered and manufactured to meet the demands of today’s base station antenna markets. 

About Rogers Corporation

Rogers Corporation is a global technology leader in engineered materials to power, protect, and connect our world.  With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, Internet connectivity, advanced transportation and other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification, and alternative energy; Elastomeric Material Solutions for sealing, vibration management, and impact protection in mobile devices, transportation interiors, and performance apparel; and Advanced Connectivity Solutions materials for wireless infrastructure, automotive safety and radar systems. Headquartered in Chandler, Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide. For more information, click here.

Share


Suggested Items

Cerambus Discusses the Next Generation in PCB Plating

07/12/2018 | Stephen Las Marias, I-Connect007
Cerambus Technology Inc. President John Nash sat down with I-Connect007 for a discussion on the latest developments in plating technology, challenges and opportunities in the China market, and their strategy for sustaining growth in a highly competitive industry.

EIPC 50th Anniversary Conference Day 2: The Past, the Present and the Future, Pt. 2

07/10/2018 | Pete Starkey, I-Connect007
Alun Morgan wrapped-up the proceedings, thanking delegates for their attention, speakers for sharing their knowledge and sponsors for their generous support. Special thanks and good wishes to Michael Weinhold for his enormous contribution over the years, and to Kirsten Smit-Westenberg and Carol Pelzers for their calm and professional organisation and management of another superb event.

EIPC 50th Anniversary Conference Day 2: The Past, the Present and the Future, Pt. 1

07/09/2018 | Pete Starkey, I-Connect007
The sun was shining in Dusseldorf as delegates returned to the conference room for the second day of the EIPC 50th Anniversary Conference. There were very few empty chairs—even those who had enjoyed a late networking session in the hotel bar had taken their seats as Paul Waldner opened the proceedings with Session 5, on a theme of future PCB design, material and processes for the PCB supply chain.



Copyright © 2018 I-Connect007. All rights reserved.