Hitachi Chemical to Build New Factory in Taiwan to Manufacture Laminate Materials for PWB

Reading time ( words)

Hitachi Chemical Co., Ltd. has decided to construct a new factory to manufacture advanced functional laminate materials for printed wiring boards (pre-preg and copper-clad laminates) on the site of Hitachi Chemical Electronic Materials (Taiwan) Co., Ltd. (HCET), Hitachi Chemical's subsidiary in Taiwan. Hitachi Chemical will invest a total of approximately 7.5 billion yen and the new factory will begin operation by April 2020.

Hitachi Chemical's laminate materials for printed wiring boards are being well received in the market, especially with demand for its advanced functional laminate materials for semiconductor packaging substrates used in various fields, including 5th generation wireless systems (5G), advanced driver-assistance systems (ADAS) and artificial intelligence (AI), expected to grow stronger in the medium- to long-term. To address its customer needs promptly under these circumstances, Hitachi Chemical has decided to invest in establishing a supply system in Taiwan, the biggest demand center for advanced functional laminate materials.

Hitachi Chemical will take advantage of this new factory to boost the sales of its advanced functional laminate materials by developing a production system capable of delivering timely supplies to its customers.

12/02/2019 | Nolan Johnson, PCB007

Nolan Johnson talks with Brian Hess of Calumet Electronics and Mike Vinson of Averatek about the new, insertable additive processes that the companies are working on together to help factories running primarily subtractive processes to quickly convert to very high-density interconnect (HDI) features, including trace and space from 2.5-mil line and space to 1-mil line and space and below.

11/22/2019 | Kelsey Smith, All Flex

Many of the issues that arise when using a flex circuit come from a lack of knowledge about how to properly design one, especially when the circuit is required to bend. Many novices will design a circuit that calls for bending the flex in too tight of a bend radius, which can cause damage to the circuit and lower the reliability of the end product. This series of articles will focus on the seven key aspects to consider when designing for maximum durability and maximum “flexibility”.

11/21/2019 | Andy Shaughnessy, Design007 Magazine

This month, I interviewed Nick Koop—director of flex technology at TTM Technologies, a veteran “flex guy” and instructor, and a leader of several IPC flex standards committees. Nick provides an update for the committees he’s involved with and discusses some of the challenges that he sees as more designers enter the world of flex.