Merlin Circuit Technology Installs New XRF Equipment


Reading time ( words)

Merlin Circuit Technology has announced the purchase and installation of a Fischer XDAL 237 SDD XRF to meet the requirements and ensure compliance to the new IPC 4552A ENIG specification (released September 17), and to optimize the ENIG plating process. The purchase is in addition to and upgrades Merlin’s existing XRF capability.

Share

Print


Suggested Items

There’s An Art to Plating

08/16/2019 | Nolan Johnson, I-Connect007
There's definitely an art to plating. Start with a generally planar substrate, then alternately put stuff on and take things off. Continue this in subtle variations until what you have is the stuff you want, where you want.

Avoiding CAF Failures at the IPC High-reliability Forum

07/31/2019 | Andy Shaughnessy, I-Connect007
Foresite CEO Terry Munson recently spoke with Andy Shaughnessy during the IPC High-Reliability Forum and Microvia Summit in Baltimore about his presentation on the causes of conductive anodic filament (CAF), the dangers of resin starvation, and what advice he'd give to PCB designers to avoid those types of failures.

Atotech Brings World-Class AHDI to the U.S.

12/06/2018 | I-Connect007 Editorial Team
During our walk-through of the GreenSource Fabrication facility with VP Alex Stepinski, he started the conversation on surface preparation and plating by saying, “We have Atotech horizontal production technology in place here. We’ve been running Atotech turnkey solutions for a while.



Copyright © 2019 I-Connect007. All rights reserved.