Advanced Copper Foil Announces New Arsenic-Free Copper Foils


Reading time ( words)

Advanced Copper Foil and its supply partner, Circuit Foil Luxemburg, are pleased to introduce its new arsenic-free copper foils. Effective immediately, the ED copper foils TWLS and TZA will be manufactured as 100% arsenic-free. All traces of arsenic have been removed from the treatment process of these two copper foil types. There is no change in the base copper foil or its properties. As mandated by REACH and European Union Regulation, toxic substances such as arsenic, will be phased out. Arsenic is identified as a poisonous substance that can have severe adverse effects on humans and the environment.   

“The printed circuit board industry is constantly changing, and we are pleased to announce this significant development to our copper foil supply chain. The elimination of arsenic from the electronics industry is an important step towards environmental and social responsibility”, says Kieran Healy, managing director of Advanced Copper Foil.

About Advanced Copper Foil

Advanced Copper Foil is the exclusive distributor of circuit foil Luxemburg and specializes in the tooling of copper foils and the manufacturing of aluminum supported copper foils for the North American printed circuit board industry. For more information, click here.

Share

Print


Suggested Items

Solder Mask Curing: UV Bump Overview

08/19/2019 | Nikolaus Schubkegel
Ultraviolet (UV) bump, also called UV cure, is a processing step in which the solder mask pattern is irradiated with ultraviolet and infrared light. This step is performed with special equipment that is built as a continuous flow system, which consists of a conveyor belt and tubular UV lamps mounted above and below the belt. Read on to find out more about this process.

Avoiding CAF Failures at the IPC High-reliability Forum

07/31/2019 | Andy Shaughnessy, I-Connect007
Foresite CEO Terry Munson recently spoke with Andy Shaughnessy during the IPC High-Reliability Forum and Microvia Summit in Baltimore about his presentation on the causes of conductive anodic filament (CAF), the dangers of resin starvation, and what advice he'd give to PCB designers to avoid those types of failures.

Focusing on Surface Sensitivity for Reliability

07/26/2019 | Andy Shaughnessy, I-Connect007
At the recent IPC High-Reliability Forum and Microvia Summit, Customer Applications Scientist Elizabeth Kidd and Sales Engineer Alex Bien, both of BTG Labs, discuss with Andy Shaughnessy their presentation on the challenges of working with highly sensitive surfaces, such as the risk of contamination. They also talked about the various surface characterization techniques that BTG Labs uses to identify such contaminants.



Copyright © 2019 I-Connect007. All rights reserved.