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NCAB Group has announced plans list its shares at the Stockholm Nasdaq exchange on June 5. The company expects the listing to help continue its growth, acquire larger customers, and buy companies.
NCAB will release more information about this listing process in 10 days.
Richard Heimsch, SUPER DRY
Research by SMT & Hybrid GmbH (now SMT Elektronik) was conducted just prior to the original publication of IPC-1601, which now provides detailed guidelines for the packaging and storage of PCBs, both from the PCB manufacturer and at the assembler’s manufacturing floor.
Rick Nichols, Sandra Heinemann, et al.
The solder mask application is one of the key considerations to ensure a successful application of a selective finish. The selective finish is the final chemical step of the PCB manufacturing process; this is when the panels are at their most valuable and are unfortunately not re-workable.
Tetsuya Sasamura, Ph.D., Tatsushi Someya, et al.
The characteristics of electroless gold/palladium/gold (IGEPIG) deposit, which has been newly developed for fine-line application as electroless nickel-phosphorus (EN) free, has been compared with that of conventional electroless Ni-P/Pd/Au (ENEPIG) deposit and electroless Pd/Au (EPIG) deposit.