RTW CPCA Show: AWP Discusses Whelen Engineering Project Success


Reading time ( words)

At the recent CPCA Show 2018 in Shanghai, Jochen Zeller, vice president of AWP Group, speaks about the challenges impacting the wet processing part of the PCB manufacturing industry, such as the continuing miniaturization trend leading to finer widths and line spacings, as well as traceability.

He discusses the need for integrated, automated lines in a factory, and how this will benefit PCB manufacturers. He also speaks about their part of the Whelen engineering project, the technology they provided, the challenges they encountered, and how they were able to help address those issues.

Watch the interview here.

Share


Suggested Items

Smartphone Substrate-Like PCBs Will Revolutionize the IC Substrate and PCB Markets

10/17/2018 | Emilie Jolivet, YOLE DÉVELOPPEMENT
The smartphone is one of the high value-add products that carries a very high demand for miniaturization. Customers expect larger screens, cameras with high resolution, and various other functions, in lighter and thinner phones.

Catching up with LiloTree’s Dr. Kunal Shah

08/02/2018 | Dan Beaulieu
Every so often, a new product comes around that promises to be a game changer and LiloTree has one of those products. Not only is it cyanide-free, it has the potential to save 40% on your entire ENIG process and is proving to be far more stable than traditional ENIG products.

CFX: Updates and Developments

02/05/2018 | Stephen Las Marias, I-Connect007
In an interview with I-Connect007, she discusses the latest developments in the Connected Factory Initiative (CFX), the machine data interface standard that would enable manufacturers, equipment, device and software suppliers to achieve Industry 4.0 benefits, and CFX demos at IPC APEX EXPO 2018.



Copyright © 2018 I-Connect007. All rights reserved.