Cirexx Earns MIL-PRF-31032 Certification Upgrade


Reading time ( words)

Cirexx International has recently completed an upgrade to their MIL-PRF-31032 certifications. The company now can certify more complex constructions to this specification. The additional features include overall board thickness, minimum hole size and aspect ratio, minimum line width and space, conductive finish and panel size.   

The appropriate test specimens were prepared by Cirexx and submitted for evaluation to DLA (Defense Logistics Agency) in Columbus, Ohio. All items were found to be conforming on the first pass and with the accompanying certification letters Cirexx is able to validate their products at the highest levels of defense/aerospace applications.

Philipp Menges, president and CEO of Cirexx said, “We needed to expand our 31032 certification because we are seeing it required more often by our customers, and for different characteristics than we originally certified to. This upgrade keeps us current and at the forefront of defense contracting.”

About Cirexx International

Founded in 1980, Cirexx International, Inc. is an electronic solutions company offering PCB Design, PCB Fabrication and PCB Assembly of high-reliability Printed Circuit Boards, RF/Microwave Circuit Boards, Flexible Printed Circuits and Rigid-Flex Circuit Boards. Recognized as a time-technology leader, the company offers a genuine Quick Turn service and provides a one stop shop and all in-house solution known as Seamless Integration. Cirexx has expertise fabricating high layer count Printed Circuit Boards using a variety of substrates including a wide array of high-frequency RF-based materials in mixed (hybrid) constructions. Cirexx delivers unsurpassed quality and support to a large array of customers in the high-reliability markets of defense/aerospace, industrial, and medical instrumentation.

For more information, click here.

Share


Suggested Items

Increasing Productivity for Flex Fabricators

11/14/2018 | I-Connect007 Editorial Team
Barry Matties and Nolan Johnson of I-Connect007 met with Shane Noel and industry veteran Mike Jennings of ESI to discuss the introduction of their CapStone laser tool, a product aimed at doubling their flex circuit fabricators’ throughput. Mike also shares advice for fabricators who are looking to move into the ever-growing flex market.

Substrates for Advanced PCB Technologies: What Will the Future Hold?

11/06/2018 | Pete Starkey, I-Connect007
The UK chapter of the global IMAPS community of electronics and microelectronic packaging engineers shared a wealth of knowledge and wisdom about PCB substrate technology trends, developments, and future requirements in a webinar on the first of November.

PCB Design, Fabrication and Use from the Mil-Aero End-User Perspective

08/28/2018 | Pete Starkey, I-Connect007
The procedures described for Rolls Royce were directly comparable with those described for MBDA, and the presenters were unanimous in re-emphasising the importance of working closely with their chosen PCB fabricators at all levels and all stages of design, qualification and production of their circuit boards.



Copyright © 2018 I-Connect007. All rights reserved.