MacDermid Enthone Releases New Immersion Tin for QFNs

Reading time ( words)

MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, announces the release of the PackagePrep CE Tin S process. This simplified tin plating process for singulated QFN package side walls provides consistent solder flank fillet formation for a more reliable solder joint under the increasingly demanding requirements of the automotive electronics industry. The superior fillet formation allowed by this new immersion tin process also improves the ease of assembly for “lead-less” chip packages, such as QFNs for a more reliable inspection of the assembled surface mount packaging, eliminating the need for X-Ray inspection of the solder joint. The process provides solderability that meets JEDEC Standard J-STD-002D.

Rich Retallick, director of Electronics Materials, MacDermid Enthone, noted, “Given the rapid growth in automotive electronics where QFNs are widely utilized, reliability is a key priority. We’re excited to provide our customers with the enhanced solderability and the option for automated optical inspection (AOI) provided by the PackagePrep CE Tin S process.” 

About MacDermid Enthone Electronics Solutions

MacDermid Enthone Electronics Solutions researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics—in everything you see, and in many things you don’t—MacDermid Enthone is there. For more information, click here.


Suggested Items

PCB Design, Fabrication and Use from the Mil-Aero End-User Perspective

08/28/2018 | Pete Starkey, I-Connect007
The procedures described for Rolls Royce were directly comparable with those described for MBDA, and the presenters were unanimous in re-emphasising the importance of working closely with their chosen PCB fabricators at all levels and all stages of design, qualification and production of their circuit boards.

Thermal Capabilities of Solder Masks: How High Can We Go?

08/24/2018 | Sven Kramer, Lackwerke Peters
This article focuses on three different coating material groups that were formulated to operate under high thermal stress and are applied at the printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications.

Circuit Automation on the Ever-Evolving World of Solder Mask

08/23/2018 | I-Connect007 Editorial Team
In a recent conference call, I-Connect007 editorial team was joined by Circuit Automation’s Yuki Kojima, VP of engineering; Larry Lindland, sales and applications manager; and Tom Meeker, CEO, for a lively discussion about solder mask. Spoiler: It’s not all about the equipment.

Copyright © 2018 I-Connect007. All rights reserved.