EIPC SpeedNews: News from the European PCB Industry

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News from EIPC

- Event Diary 2019

Electronics Industry News

- China Vendors Set to Dethrone Korea Brands in Global Smartphone Market

- Seeking New Growth Drivers, Samsung Plans $22 Billion Spending on New Technology

- Electronic Shortages - Bad, and Getting Worse

- Algorithms Outpace Moore’s Law for AI

News from Germany 

- Schweizer Lays Cornerstone for New Production Site in Jintan

- Schweizer Electronic Confirms Good Figures for the 1H 2018

News from Norway

- Elmatica and Altlight: Advantage of Early Partnership

News from the UK

- POP2 - A Unique IMAPS-UK Conference and Exhibition

- IMAPS-UK to Hold Event at the Gallery Conference Center

- Ventec International Group’s German Facility Successfully Passes ISO 9001:2015 Audit

News from the USA

- George Janosko Joins Ventec International Group Technical Sales Team for Mid-West USA

Click here for the International Events Diary 2018 

Click here to download the complete SpeedNews Issue 18



Suggested Items

Alun Morgan on Thermal Management and LEDs in Automotive

04/25/2019 | Judy Warner
Guest Editor Judy Warner met with Alun Morgan, technology ambassador for Ventec International Group, to discuss topics addressed at the Automotive Executive Forum that took place at IPC APEX EXPO 2019. Morgan describes his presentation and findings centered around thermal management in automotive, specifically LEDs, as well as the unique set of growing thermal management challenges Tier 1 suppliers are now facing in the automotive sector.

Ventec Focuses on High-mix Manufacturing

04/09/2019 | Barry Matties, I-Connect007
The I-Connect007 team recently toured Ventec International Group’s Suzhou factory where a modern, flexible manufacturing concept designed for fast delivery is enhancing their established volume manufacturing of specialty, high-reliability epoxy laminates and prepregs. Read on to know more about Ventec's ongoing investment in the facility to offer flexible world-class high-mix manufacturing capabilities for polyimide, thermal management, low-loss, and signal integrity material solutions.

EIPC Winter Conference, Day 1

03/19/2019 | Alun Morgan, EIPC
EIPC Chairman Alun Morgan writes about the highlights of and the technical discussions at the recent EIPC Winter Conference held in Milan last February 14–15.

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