EIPC SpeedNews: News from the European PCB Industry

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News from EIPC

- Event Diary 2019

Electronics Industry News

- China Vendors Set to Dethrone Korea Brands in Global Smartphone Market

- Seeking New Growth Drivers, Samsung Plans $22 Billion Spending on New Technology

- Electronic Shortages - Bad, and Getting Worse

- Algorithms Outpace Moore’s Law for AI

News from Germany 

- Schweizer Lays Cornerstone for New Production Site in Jintan

- Schweizer Electronic Confirms Good Figures for the 1H 2018

News from Norway

- Elmatica and Altlight: Advantage of Early Partnership

News from the UK

- POP2 - A Unique IMAPS-UK Conference and Exhibition

- IMAPS-UK to Hold Event at the Gallery Conference Center

- Ventec International Group’s German Facility Successfully Passes ISO 9001:2015 Audit

News from the USA

- George Janosko Joins Ventec International Group Technical Sales Team for Mid-West USA

Click here for the International Events Diary 2018 

Click here to download the complete SpeedNews Issue 18


Suggested Items

Ventec Keeps 'Shaking Things Up' with tec-speed 20.0

09/10/2018 | Barry Matties, I-Connect007
At the EIPC summer conference, I-Connect007 Publisher Barry Matties caught up with Ventec Europe & Americas COO Mark Goodwin, who provided an update on Ventec’s new products, the current state of the company, and how Ventec is shaking things up in the materials marketplace.

Bridging Knowledge and Understanding of Thermal Management Materials

03/14/2018 | Pete Starkey, I-Connect007
At IPC APEX EXPO recently, Pete Starkey and Ian Mayoh, Ventec International’s technical support manager, had a chance to sit down and discuss the I-Connect007 micro E-book: The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, of which Ian is a co-author.

RTW IPC APEX EXPO: Ventec's Jack Pattie on New Materials, Industry Upswing

03/13/2018 | Real Time with...IPC
Ventec International Group’s Jack Pattie comments on continuing growth in sales, investment in manufacturing and distribution, and new product developments in polyimides, no-flow pre-pregs and thermally conductive materials.

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