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In this month, the September edition of PCB007 Magazine, we learn a few new acronyms.
PCBs are approaching semiconductors with regard to feature sizes and this trend shows no signs of slowing down. Our experts this month are helping us understand substrate-like PCBs (SLP) and the semi-additive processes that will help the industry achieve what seemed impossible just a few years ago.
Check it out this month in PCB007 Magazine, now on the virtual newsstand and available for delivery in your e-mailbox each month by subscribing here.
For future reference, be sure to download the pdf version.
Dr. John Mitchell, IPC
President Trump kicked off the workforce challenge to U.S. businesses in July. As a longtime leader in education and training within the electronics industry, IPC took it as an opportunity to review our existing programs and identify ways to grow and innovate. The result? IPC joined the Pledge to America’s Workers by promising to create new career opportunities for at least 1 million Americans in the electronics industry.
Dr. Xiaoxi HeSenior, IDTechEx
From 2019 we will come to a world with flexible electronics and batteries to power these devices have attracted tremendous attention. These devices may require batteries with special mechanical properties or form factors.
Barry Matties, I-Connect007
At the recent EIPC Summer Conference, Hans Friedrichkeit of the PCB Network gave an engaging presentation on artificial intelligence and future technologies, which was well received by attendees. Who better than Hans to offer insight on which future megatrends might truly become game changers? Publisher Barry Matties sat down with Hans to get his take on trends such as 5G, autonomous cars and 3D printing.