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Bowman has introduced an extra-long, extended stage option for its XRF plating thickness instruments that are primarily used in the semiconductor/wafer manufacturing industry.
In this sector, circuit density, trace spacing, board gauge, aspect ratios and microvias dominate, and demand is strong for a way to measure more and smaller test points.
In some high-volume operations, rigid/flex boards can be as large as 610x530mm, and while it is impractical to cover that surface area in one pass, the Bowman extended stage option allows the task to be accomplished with just a single, quick re-positioning step.
The Bowman extended stage option had its genesis with two long-term PCB customers, independent of each other, who requested a 400x300mm (16x12”) table stock with a tabletop size of 800x600mm (32x24”).
A longer stroke potential and a more expansive tabletop has created an efficient and unprecedented new dynamic for quality labs throughout the
microelectronics sector. Standard XY travel is 6.5 x 5” with an approximately 14x13” tabletop; extended XY travel with the Bowman stage is 10x10” with approximately 26X25” – a significant advancement for any high-production microelectronics environment.
Bowman’s extended table accuracy is +3µm or better. The option is now available for 3 of Bowman’s 7 XRF coating thickness instruments, the “P”, “O” and “M” Series. These are the 3 systems most commonly selected for PCB/ microelectronics quality programs, as well as related small parts such as connectors.
Bowman is a leading manufacturer of precision XRF benchtop coating measurement systems, with a robust local service network that provides same-day response for every XRF requirement, worldwide. Equipment evaluation, selection, commissioning, maintenance and modernization is provided for users of all Bowman instruments, as well as other XRF brands. All Bowman systems are manufactured in the USA.