MacDermid Enthone Advanced Electronics Solutions to Present at the 2018 IMAPS International Conference

Reading time ( words)

MacDermid Enthone Electronics Solutions (MEES), a MacDermid Performance Solutions business, will present at the 51st International Symposium on Microelectronics - IMAPS 2018. The conference will be held October 8-11, at the Pasadena Convention Center, Pasadena, California, USA.

Eric Gongora, general manager Americas and Europe and strategic marketing director of Wafer Level Packaging, MacDermid Enthone Advanced Electronics Solutions (AES), will address the continuous challenges faced in developing advanced packaging electroplating chemistries required to meet the performance, operational efficiency and time to market demands driven by the need for higher level of integration and heterogeneous solutions. Eric will present his paper; “Customization of Chemistry Continues“, on Wednesday, October 10 Session 118 at 11:00am. Eric will also serve as Session Chair for the Wafer-level Fan Out segment of the conference.

AES, a segment within the MEES business, is a global leader in high performance semiconductor chemistries and assembly materials. AES engages directly with OEMs, IDMs, wafer foundries, OSATs and tool suppliers to collaboratively develop solutions that meet the fast paced semiconductor market demands.

About MacDermid Enthone Electronics Solutions

MacDermid Enthone Electronics Solutions researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there. 

For more information, click here.


Suggested Items

GP Ventures’ Tom Kastner on PCB Mergers and Acquisitions

10/10/2018 | Dan Beaulieu, D.B. Management Group
Tom Kastner, president of GP Ventures, he has his finger on the pulse of the industry's mergers and acquisitions (M&A) more than anyone. In this interview, Kastner provides insights on the right time to buy, how to evaluate your company's worth, and when it is too late.

PCBs Are Moisture-Sensitive Devices

09/07/2018 | Richard Heimsch, SUPER DRY
Research by SMT & Hybrid GmbH (now SMT Elektronik) was conducted just prior to the original publication of IPC-1601, which now provides detailed guidelines for the packaging and storage of PCBs, both from the PCB manufacturer and at the assembler’s manufacturing floor.

Reliability Takes on a New Urgency

09/05/2018 | Patty Goldman, I-Connect007
Consumers wanted a reliable car that wouldn’t break down on the road; a computer that wouldn’t crash; a phone network that wouldn’t drop our calls; the plane we were hurtling across the sky in to stay in the air and land safely, with the wheels down. In retrospect, those seem rather simple wants, and the industry certainly wants to deliver.

Copyright © 2018 I-Connect007. All rights reserved.