Atotech’s Surface Finish Specialist Rick Nichols at SMTAI 2018


Reading time ( words)

Rick Nichols, global product manager surface finishing at Atotech Group, is invited to the Surface Finish Expert Panel at this year’s SMTA conference 2018 currently held at the Donald Stephenson Convention Center in Rosemont, USA. The Surface Finish Expert Panel will be hosted on Wednesday, October 17, from 11:00 am to 12:00 p.m.

Rick Nichols will also speak at the SMTA conference itself about Atotech’s latest studies and results on cyanide-free immersion gold (at 11:30 am) and immersion tin for Quad Flat No-lead ICs (at 3:30 pm), both today, Tuesday, October 16, 2018.

In his talk “Can a cyanide free immersion gold bath be a viable option in the existing final finish production environments?” Rick discusses a cyanide-free gold plating solution which was tested in combination with different electroless nickel baths, specifically a mid-phosphorous electroless nickel (MP) and a high-phosphorous electroless nickel (HP).

“When pitted against a traditional immersion gold process in terms of solderability, the novel cyanide-free matrix for an immersion gold bath performed equally as well as the cyanide containing gold baths as a main stream functional finish on MP electroless nickel,” states Rick. “The cyanide free gold bath also has performance and life-time benefits over the cyanide containing gold baths for life times when capping HP nickel, which is being championed by several significant mobile device OEMs at the moment.”

In his presentation on “immersion tin to improve reliability for Quad Flat No-lead ICs by forming a 3D solder joint”, Rick will focus on the incorporation of an immersion tin process when plating Quad Flat No-lead (QFN) devices, as this will make a 3D connection or fillet possible. He will explore the processes required and highlight the main benefits, which are quality enhancement and the potential to improve the reliability of automatic optical inspection (AOI).

Atotech invites all conference visitors to join the talks and meet Rick Nichols to discuss these and other current product highlights.

Share

Print


Suggested Items

EIPC Winter Conference, Day 1

03/19/2019 | Alun Morgan, EIPC
EIPC Chairman Alun Morgan writes about the highlights of and the technical discussions at the recent EIPC Winter Conference held in Milan last February 14–15.

RTW IPC APEX EXPO 2019: Limata Unveils Exciting Developments in LDI

03/07/2019 | Real Time with...IPC
Lino Sousa, sales, Limata, explains to Pete Starkey the latest developments in Limata’s laser direct imaging technology, which eliminates the need to change the solder mask.

Chemical Recycling as Part of a Zero-effluent Strategy

03/06/2019 | Happy Holden, I-Connect007
Green manufacturing methodologies for PCBs are becoming a global shift. Green efforts have been underway in the European Union for quite some time. Likewise, in the United States, new PCB manufacturers are building zero-waste, zero-effluent facilities and gaining certification as such.



Copyright © 2019 I-Connect007. All rights reserved.