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Taiwan-based Taiflex Scientific, which supplies flexible copper-clad laminates (FCCL) and PV module backsheets, has reported a 15.2% year-on-year drop in its net profits for the third quarter of 2018 to NT$238 million ($7.7 million), according to Digitimes.
Taiflex attributed the profit decrease to falling revenues and losses generated by its PV backsheet business. Falling demand from China due to the government's new policy to reduce feed-in tariffs and limit subsidies has prompted the company to scale down the business.
Pete Starkey, I-Connect007
The UK chapter of the global IMAPS community of electronics and microelectronic packaging engineers shared a wealth of knowledge and wisdom about PCB substrate technology trends, developments, and future requirements in a webinar on the first of November.
E. Walch, DJ., C. Rietmann, Ph.D., and A. Angstenberger, Ph.D.
The industry is seeing ever-more stringent requirements of interconnect technologies (ICT) from die through final assembly, in particular digital and analog high frequencies, undistorted signal propagation and efficient heat propagation are concerned.
Tara Dunn, OMNI PCB
SAP, mSAP, SLP—what kind of crazy acronyms have we adopted now, and how much do you really need to know? In terms of consumer electronics, there is a good chance that the smartphone attached to your hand at all times contains a PCB fabricated with this technology—or at the very least, the next-generation smartphone that you purchase will utilize mSAP technology.