EIPC SpeedNews: News from the European PCB Industry


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News from EIPC

- Updated Program EIPC Winter Conference Milan, February 14–15, 2019

News from Germany 

- Ventec Completes Phase I of $300k Investment Plan at its German Service Center

Electronics Industry News

- Apple Assembler Foxconn Considering iPhone Factory in Vietnam

News from the UK 

- AdoptSMT UK Ltd for Southern Manufacturing & Electronics

- MicroTech 2019, Call for Presentations

News from WECC Members

Click here for the International Events Diary 2018-2019

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TTM on Flex and Rigid-flex PCB Challenges

03/20/2019 | Barry Matties, I-Connect007
One of the biggest bareboard manufacturers in the world, TTM Technologies has seen a recent surge in flex and rigid-flex demands from their customers. In this interview, Clay Zha, Vice President of Technology Solutions of TTM’s Mobility business unit, and VP of Corporate Marketing Winnie Ng discuss the differences in manufacturing flex versus traditional PCBs, and the increasing need for rigid-flex HDI boards.

Dan Gamota Discusses Flex and Alternative Substrates

03/14/2019 | Patty Goldman and Andy Shaughnessy, I-Connect007
As the VP of manufacturing technology and innovation for Jabil, Dan gave us his take on the current state of flex and alternative substrates and explained why modeling, automation, and process controls are likely to be key ingredients in the recipe for manufacturing non-FR-4 boards in the future.

The Smart Factory IQ Test

03/13/2019 | Nolan Johnson, I-Connect007
Let's see how prepared you are to talk about Industry 4.0. The following 12-question test will measure how much you know about smart factory concepts and philosophies. Since the concept of a smart factory is larger than the electronics manufacturing industry and encompasses the entire supply chain, the terms and concepts here are also more global in nature.



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