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- Updated Program EIPC Winter Conference Milan, February 14–15, 2019
- Ventec Completes Phase I of $300k Investment Plan at its German Service Center
- Apple Assembler Foxconn Considering iPhone Factory in Vietnam
- AdoptSMT UK Ltd for Southern Manufacturing & Electronics
- MicroTech 2019, Call for Presentations
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Suggested Items
Ventec’s Book on Thermal Management: The Summer Sequel You’ve Been Waiting For
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I-Connect007
I-Connect007 is excited to announce the release of the second title in Ventec’s series on thermal management, "The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates, Volume 2." This second volume covers the latest developments in the field of thermal management, particularly in insulated metal substrates, using state-of-the-art products as examples, and focusing on specific solutions and enhanced properties of IMS.
Real Time with… IPC APEX EXPO 2022: The Supply Chain and Markets
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Real Time with...IPC APEX EXPO
Pete Starkey interviews Mark Goodwin, COO of Ventec International, on the impact of the current supply chain condition. Their conversation also covers aerospace and the U.S. market. If you were unable to attend IPC APEX EXPO 2022, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/17/2021 |
Andy Shaughnessy, Design007
I’m starting to get more and more out-of-office replies. Are you reading this on your phone while standing in line at Best Buy? But if you’re reading this, here’s to you! It’s been a pretty good year—much better than last year, though that’s a fairly low bar to clear. It’s a mixed bag this week, with news about trade shows, along with articles and interviews focusing on everything from education to methods for dealing with supply chain issues by staying flexible and taking action earlier in the process.
