Reading time ( words)
- Updated Program EIPC Winter Conference Milan, February 14–15, 2019
- Ventec Completes Phase I of $300k Investment Plan at its German Service Center
- Apple Assembler Foxconn Considering iPhone Factory in Vietnam
- AdoptSMT UK Ltd for Southern Manufacturing & Electronics
- MicroTech 2019, Call for Presentations
Share
PrintSuggested Items
TTM on Flex and Rigid-flex PCB Challenges
03/20/2019 |
Barry Matties, I-Connect007
One of the biggest bareboard manufacturers in the world, TTM Technologies has seen a recent surge in flex and rigid-flex demands from their customers. In this interview, Clay Zha, Vice President of Technology Solutions of TTM’s Mobility business unit, and VP of Corporate Marketing Winnie Ng discuss the differences in manufacturing flex versus traditional PCBs, and the increasing need for rigid-flex HDI boards.
Dan Gamota Discusses Flex and Alternative Substrates
03/14/2019 |
Patty Goldman and Andy Shaughnessy, I-Connect007
As the VP of manufacturing technology and innovation for Jabil, Dan gave us his take on the current state of flex and alternative substrates and explained why modeling, automation, and process controls are likely to be key ingredients in the recipe for manufacturing non-FR-4 boards in the future.
The Smart Factory IQ Test
03/13/2019 |
Nolan Johnson, I-Connect007
Let's see how prepared you are to talk about Industry 4.0. The following 12-question test will measure how much you know about smart factory concepts and philosophies. Since the concept of a smart factory is larger than the electronics manufacturing industry and encompasses the entire supply chain, the terms and concepts here are also more global in nature.
