GrapheneCA Joins IntelliFLEX


Reading time ( words)

Nano Graphene Inc. dba GrapheneCA has joined the ranks of IntelliFLEX, the Canadian organization which aims to unite industrial companies and research and academic organizations into effective supply chains for flexible, 3D printable electronics, 2D large area printable electronics, wearable electronics, smart textiles and hybrid electronics, including related semiconductors, integrated circuits and software.

“We are extremely proud to have such a highly innovative and respected graphene developer/manufacturer join our organization, and we look forward to fruitful collaborations in the very near future”, said intelliFLEX President and CEO, Peter Kallai.

A dynamic industry force, intelliFLEX, is a not-for-profit industry alliance partnering with more than 300 organizations across Canada to accelerate the growth of the flexible and hybrid electronics sector.

For its part, GrapheneCA is on a mission to work with a network of Canadian businesses to promote tech development. “We indeed look forward to partnering with the industry to demonstrate how graphene can be used in the next generation of sensors, thin film and composites, to name but a few applications”, said David Robles, GrapheneCA’s NYC-based head of business development, who went on to say, “These devices are changing how electronics are made and are what the future holds for such things as antennas, networking devices, IoT building blocks and circuit boards.”

“This is in line with GrapheneCA’s commitment to being a good industry player and contributor to driving the future forward. We have short-term plans to operate out of Montreal and are focused on becoming a fully-fledged member of the Canadian community. IntelliFLEX is introducing us to some of their key members, and we are eager to begin working with them as well as joining into education events,” he added.

Share

Print


Suggested Items

Dan Gamota Discusses Flex and Alternative Substrates

03/14/2019 | Patty Goldman and Andy Shaughnessy, I-Connect007
As the VP of manufacturing technology and innovation for Jabil, Dan gave us his take on the current state of flex and alternative substrates and explained why modeling, automation, and process controls are likely to be key ingredients in the recipe for manufacturing non-FR-4 boards in the future.

RTW IPC APEX EXPO 2019: Insulectro Sees Growth and Opportunities in Printed Electronics

03/11/2019 | Real Time with...IPC
Judy Warner speaks with Tim Redfern, Insulectro president, and Kevin M. Miller, VP of sales, about growth in the printed electronics market, the direction Insulectro is going, and opportunities for North American PCB suppliers. They note that the company will increase their focus and investment in the printed electronics market.

Flex/MSTC Joint Conference: A Collaborative Week in Monterey

03/06/2019 | Nolan Johnson, I-Connect007
Collaboration filled the air at the Hyatt Regency in Monterey, California, as the 18th annual Flex/Mems&Sensors technical conference brought flex technology and sensor experts and 550+ attendees together to network and share ideas from February 18–21, 2019.



Copyright © 2019 I-Connect007. All rights reserved.