RTW IPC APEX EXPO 2019: Insulectro Sees Growth and Opportunities in Printed Electronics


Reading time ( words)

Judy Warner speaks with Tim Redfern, Insulectro president, and Kevin M. Miller, VP of sales, about growth in the printed electronics market, the direction Insulectro is going, and opportunities for North American PCB suppliers. They note that the company will increase their focus and investment in the printed electronics market.

To watch the interview, click here.

Share




Suggested Items

Ventec’s Book on Thermal Management: The Summer Sequel You’ve Been Waiting For

06/24/2022 | I-Connect007
I-Connect007 is excited to announce the release of the second title in Ventec’s series on thermal management, "The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates, Volume 2." This second volume covers the latest developments in the field of thermal management, particularly in insulated metal substrates, using state-of-the-art products as examples, and focusing on specific solutions and enhanced properties of IMS.

Uncovering the Electronics Ecosystem

04/08/2022 | Nolan Johnson, I-Connect007
Nolan Johnson speaks with Will Marsh, vice president of TTM Technologies and president of the Printed Circuit Board Association of America, about the work the PCBAA has been doing in Washington, D.C., to get the industry better recognized by the country’s decision-makers. Marsh is optimistic, not only about the companies and individuals joining the effort, but in the recognition by Capitol Hill to secure the nation’s defense systems.

Improved Thermal Interface Materials For Cooling High-Power Electronics

03/31/2022 | Jeff Brandman, Aismalibar North America
Heat has been a significant concern in electronics since the beginning of the electronics age when hot glowing vacuum tubes were first used to receive and transmit data bits. The transistor and integrated circuit effectively solved that basic problem, but increases in integration resulted in increased concentration of heat, exacerbated by relentless increases in operating frequency. While improvements in electronics technology have been able to mitigate many thermal issues at chip level thanks to improved semiconductor designs devised to operate at lower voltages (thus requiring less energy) the thermal management challenge continues to vex electronic product developers.



Copyright © 2022 I-Connect007. All rights reserved.