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IPC SummerCom to Feature Panelpalooza
April 19, 2019 | IPCEstimated reading time: Less than a minute
The IPC SummerCom, to be held on June 15–20, in Raleigh, North Carolina, will feature Panelpalooza, a highly interactive panel platform that will cover challenges currently facing the electronics industry.
Topics covered during panels include BTC challenges, cleanliness measurements for process control, warpage-induced defects, microvia reliability, harmony between standards, and next-generation solder alloy developments.
For any questions about registering for the IPC standards development committee meetings, please contact your committee's staff liaison. Reach out to Brook Sandy-Smith, technical education program manager at BrookSandy@ipc.org, to share ideas for topics or volunteer to join as one of our esteemed panelists.
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Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
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