Patty's Perspective: From Start to Finish


Reading time ( words)

I could also say, "From Beginning to End," though that is not quite the same meaning. Our topic this month is "From Design Through Final Product" as it pertains to flexible and rigid-flex circuits. Because designing a circuit to fit in the envisioned space and perform as intended can be far from simple or obvious—but you already know that. In fact, not being a designer, I can’t imagine designing a simple circuit, let alone one that must bend or fold into a shape and space that may be just an idea in an inventor’s mind.

But of course, it is done every day by many of our readers. Is it easy for you? Our goal in this issue is to provide insights into how best to accomplish the seemingly daunting task—and with a new and different design each time. A lot of it boils down to one factor: work with your supplier and customer. You are a team, and you need to think and work together as a team with one goal: an elegantly designed product produced in a reasonable time at a reasonable cost (or at least a reasonable future cost).

Interested in some good advice? Read on!

Share

Print


Suggested Items

Why Designers Need to Be at the SMTA Additive Electronics Conference

10/18/2019 | I-Connect007
In a recent interview, Kelly Dack and Tara Dunn (Omni PCB president and conference co-chair) discussed why designers need to attend the SMTA Additive Electronics Conference. Tara will also be attending and moderating a panel discussion at the conference.

Decreasing Bend Radius and Improving Reliability—Part I

10/11/2019 | Kelsey Smith, All Flex
Many of the issues that arise when using a flex circuit come from a lack of knowledge about how to properly design one, especially when the circuit is required to bend.

Insertion Loss Performance Differences Due to Plated Finish and Circuit Structure

10/02/2019 | John Coonrod, Rogers Corporation
Data will be presented for loss versus frequency for six different plated finishes commonly used in the PCB industry, and opinions will be offered as to why the loss behavior differs for the different plated finishes and for the different circuit configurations. Because the insertion loss of high-frequency circuits also depends on substrate thickness, circuits fabricated on substrates with different thicknesses will be evaluated to analyze the effects of substrate thickness on insertion loss.



Copyright © 2019 I-Connect007. All rights reserved.