EIPC SpeedNews: News from the European PCB Industry


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News from EIPC

- 3rd EIPC PCB Bio MEMs Workshop, June 12, 2019, Leoben

- Program Available! EIPC Summer Conference Leoben, June 13–14, 2019

- What’s New In Electronics—EIPC PCB Pavilion, PODs Available

Electronics Industry News

- China Start-Up Undercuts Samsung, Huawei Foldables

- Worker Shortages Plague EU Electronics OEMs

News from Germany

- Schweizer Releases Annual Results

News from Taiwan

- ITEQ Corp. and COM.INT.EL Announce IT-170GRA1 Laminate and Prepregs Available in Europe

News from the UK 

- Semiconductor Packaging Workshop, June 6, 2019, Newport Wafer Fab, Newport

News from the USA

News from the USA 

- Isola Appoints Sean Mirshafiei as New Chief Sales and Marketing Officer 

News from WECC Members

Click here for the International Events Diary 2019

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Microvias: Links of Faith are Not Created Equally

07/18/2019 | Jerry Magera and J.R. Strickland, Motorola Solutions Inc.
Microvias connect adjacent copper layers to complete electrical paths. There are copper-filled microvias, which can be stacked to form connections beyond adjacent copper layers, and staggered microvias, which stitch adjacent copper layers with paths that meander on the layers between the microvias. This article discusses the various laser-drilled microvias and presents SEM photographs to begin the search for the root cause of weak copper interface.

An Examination of Glass-fiber and Epoxy Interface Degradation in Printed Circuit Boards

07/12/2019 | Bhanu Sood, Michael Osterman, and Michael Pecht, Center for Advanced Life Cycle Engineering
Multilayer organic laminates, which make up over 90% of the interconnecting substrates in electronics (standard FR-4 represents 85% of the substrates used for laminates), can develop a loss of electrical insulation resistance between two biased conductors due to conductive filament formation.

Emma Hudson: From Tomboy to Tech Lead

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Interview between Emma Hudson and Gayle Paterson, founder of FLITE (Female Leaders in Tech, Everywhere).



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