Rogers to Participate in Baird’s Global Conference


Reading time ( words)

Rogers Corporation will be presenting at Baird’s 2019 Global Consumer, Technology & Services Conference, on Tuesday, June 4, 2019, at 3:45 p.m. Eastern time in New York. Bruce Hoechner, president and CEO, who will be joined by Mike Ludwig, SVP and CFO, will provide an overview of the company; discuss its competitive position and its strategies for growth.

A live audio webcast of the presentation will be available on the Rogers Corporation website, www.rogerscorp.com, under the investor relations section.

About Rogers Corporation

Rogers Corporation is a global leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, internet connectivity, and safety and protection applications, as well as other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, e-Mobility and renewable energy; Elastomeric Material Solutions for sealing, vibration management and impact protection in mobile devices, transportation interiors, industrial equipment and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety and radar systems. Headquartered in Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide.

Share

Print


Suggested Items

Materials for Automotive Applications: Thermal Management Issues

07/02/2020 | Pete Starkey, I-Connect007
For Pete Starkey, the highlight of the recent HDP User Group Automotive Technology Webinar was Alun Morgan’s presentation on materials for automotive applications. This forward-looking informational session covered the latest developments in automotive standards and automotive electronic packaging.

The iNEMI 2019 Roadmap: Flexible Hybrid Electronics

06/04/2020 | Pete Starkey, I-Connect007
The emerging trend for “electronics on everything, everything with electronics” was the theme of iNEMI’s webinar presentation of the highlights of its recently published Flexible Hybrid Electronics Roadmap Chapter, delivered by Girish Wable, senior engineering services manager with Jabil. Pete Starkey provides an overview.

3D Additive Electronics Manufacturing: Are We Nearing an Inflection Point?

05/28/2020 | Dan Feinberg, I-Connect007
Recently, Dan Feinberg was invited to attend a detailed and broadly informative webinar by nScrypt titled “The Strength of 3D-Printed Electronics," which covered the status and advances in the use of 3D printing for electronic device design and manufacture. nScrypt is an Orlando-based company founded in 2002 that focuses on 3D printing. Here’s what Dan learned from each of the speakers.



Copyright © 2020 I-Connect007. All rights reserved.