Super PCB Offers HDI PCBs


Reading time ( words)

Super PCB now offers high density interconnect (HDI) PCBs. HDI products have a higher wiring density per unit area than traditional PCBs and offer faster transmission, less signal loss, fewer delays and are more compact. 

PCB technology has been evolving with changing technology that calls for smaller and faster products. HDI PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities.

Designers using HDI methods now can place more components on both sides of the PCB if desired. As a result, an HDI PCB provides designers with more space to work with, while allowing them to place smaller components even closer together.

HDI PCBs are ideal for all types of digital devices where miniaturization is key to the effective application of the product. Additionally, they are used in medical devices, automobiles, aircraft and other vehicles that rely on electronics.

About Super PCB

Super PCB is the source for all of your high-quality PCB needs! Since 2003, the company has been providing high quality PCBs to numerous companies in a broad spectrum of industries, from consumer electronics to telecommunications, new energy, aerospace, automotive and more. Super PCB’s facilities are certified to TS16949, ISO9001 and UL. For more information, visit www.superpcb.com. 

Share

Print


Suggested Items

EIPC Summer Conference 2019, Day 1

09/10/2019 | Alun Morgan, EIPC
The beautiful city of Leoben in central Austria provided the setting for the EIPC 2019 Summer Conference. In this article, EIPC Chairman Alun Morgan provides the highlights of the first day of the event, including a recap of the technical presentations.

NCAB 2019 Market Report: Competition Is Heating Up

09/09/2019 | Nolan Johnson, I-Connect007
Chris Nuttall, chief operations officer and VP of technology of NCAB Group, talks about the company's most recently released market report. Nolan Johnson and Nuttall discuss some of the market drivers and conditions the industry can expect to close out in 2019 as well as what to prepare for in 2020.

A Conversation with Karen McConnell—An Emerging Engineer Program Mentor

07/22/2019 | Linda Stepanich, IPC
IPC’s Emerging Engineer program, launched in 2016, provides early career professionals an opportunity to learn from dedicated industry volunteers who participate in IPC standards development. IPC’s editorial staff had the opportunity to talk with one of those dedicated volunteers, mentor Karen McConnell, Senior Staff Engineer CAD CAM, Northrop Grumman, about why she participates as a mentor in IPC’s Emerging Engineer program.



Copyright © 2019 I-Connect007. All rights reserved.