UK First for GSPK


Reading time ( words)

GSPK Circuits has announced that they are the first PCB manufacturer in the UK to install a new line to produce the exciting new EPAG finish.

EPAG electroless palladium autocatalytic gold is a new direct palladium surface finish process with an optional gold layer.

Atotech has developed the advanced PallaBond process, which allows the direct deposition of palladium on copper, without using any nickel and offers two to three times more production capacity because of shorter deposition times compared to ENEPIG (electroless nickel/electroless palladium/immersion gold).

PallaBond, an autocatalytic palladium final finish, is a future generation high end finish with excellent solderability as well as high frequency and low signal loss attributes. It has excellent wire bonding credentials, providing very good bonding capability with gold- and silver- wires, as well as proven bonding capabilities with copper- and copper-palladium wires. The process is suitable for high frequency and key press applications, providing maximum fine feature resolution and definition.

The totally phosphor free finish is bio-compatible, consuming less energy and water than ENIG (electroless nickel/immersion gold), ENEPIG and immersion tin finishes. Its operating temperatures are lower than competitive final finish processes.

Steve Lloyd, managing director, said "The industry has been crying out for a solution like this to be readily available in the UK and it’s great that we can lead the way."

Share

Print


Suggested Items

Benchmarking Your Process Engineering

04/29/2021 | I-Connect007 Editorial Team
Mark Thompson has been in bare board fabrication for over 30 years. He is now laying out printed circuit boards at Monsoon Solutions, a high-tech design bureau near Seattle, Washington. With Mark’s extensive hands-on knowledge of PCB manufacturing, he brings a unique perspective to PCB design. In this discussion with the I-Connect007 editorial team, Mark shares what’s important from a process engineer’s point of view, and how to stay on top of evaluating and benchmarking your manufacturing process, along with insights from his new role as a designer.

Isola Releases IS550H Material

04/26/2021 | Nolan Johnson, I-Connect007
Nolan Johnson speaks with Michael Gay of Isola and Chris Hunrath of Insulectro about the release of their new halogen-free, high-thermal reliability material, which they hope fills the gap in the market between epoxies and polyimides.

EIPC Technical Snapshot: Supply Chain and Material Price Pressures

04/26/2021 | Pete Starkey, I-Connect007
EIPC’s seventh Technical Snapshot webinar on April 14 was timely and appropriate. In the context of current supply chain issues and material price pressures facing the PCB industry, particularly in Europe, the EIPC team brought together an outstanding group of experts—each a leading authority in his field—to analyse and comment upon the areas of concern and to respond to questions raised by a capacity audience. As Alun Morgan said, “If you don’t use the European supply chain, you won’t have it anymore!”



Copyright © 2021 I-Connect007. All rights reserved.