Unimicron, Na Ya to Gain from High-Specs ABF Substrates in 2H19

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The ever-growing demand for high-performance computing (HPC) chips to support 5G and AI applications is ushering in a long-missed market recovery for ABF substrates needed for high-end processors, and Taiwan major makers Unimicron and Nan Ya PCB both have stressed that ABF substrates will be their biggest business highlights in the second half of 2019, Digitimes reported.

Unimicron will invest NT$20 billion ($642.98 million) to build a new plant in Taoyuan, northen Taiwan within four years for the production of ABF substrates with upgraded specs for HPC processors. As for Nan Ya, it will also roll out new ABF substrates for HPC chips and 7nm graphic card chips in 2019, and will continue its R&D on new substrate products.



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