NPL Webinar Update: Effect of Bias CAF Failures of Electronic Circuits

Reading time ( words)

Achieving high reliability in service is the key issue in today's high-density electronic circuits. The voltage applied to the electronic circuit plays a very important role in electrochemical reliability. And insulation resistance (IR) measurement has been widely used to predict and evaluate the reliability of electronic circuit.

The test voltages for existing IR measurement are only up to 300 V. Trends for more electric vehicles mean that the measurements need to be conducted at significantly increased voltages to understand potential new failure mechanism when using voltages up to 1000 V.

Conductive anodic filament (CAF) formation inside PCBs is an important failure of the electronic circuit. Special designed PCBs with CAF patterns of different via to via distances will be tested at different voltages up to 1000 V. The relationship between via to via distance and test voltage of CAF failure will also be investigated.

In line with this, the National Physical Laboratory will hold a webinar on July 16, 2019, 6:30 a.m. - 8:00 a.m. PDT, to help the industry understand the effect of bias (up to 1,000V) on conductive anodic filament (CAF) failures of electronic circuits.

Find out more in NPL’s webinar. To register, click here.



Suggested Items

Electrolytic Plating: Filling Vias and Through-holes

05/28/2019 | M. Özkök, S. Lamprecht, A. Özkök, D. Akingbohungbe, and M. Dreiza, Atotech Deutschland Gmbh; and A. Stepinski, Greensource Fabrication
The continuously evolving electronics industry environment is causing the development of various electrolytic copper processes for different applications over the past several decades. This article describes the reasons for development and a roadmap of dimensions for copper-filled through-holes, microvias, and other copper-plated structures on PCBs.

Creating Smart Surfaces with Electronic Functionality

05/06/2019 | Pete Starkey, I-Connect007
Of all of the technical user presentations I attended at the AltiumLive design summit in Munich, the one I found most fascinating introduced an innovative technology that encouraged a bit of lateral thinking and appealed to my creative side: the IMSE, or injection-moulded structural electronics.

Weiner’s World

12/29/2016 | Gene Weiner, Weiner International Inc.
Rather than joining the annual forecast fray by attempting to provide guidance or guesses as to the outlook for the PCB and electronic assembly businesses in 2017, I thought I would provide a different year-end assessment. Here are a few thoughts for the New Year and beyond from a long-term colleague and friend of the past half century, Harvey Miller, electronics market researcher, consultant and founder of Fabfile Online.

Copyright © 2019 I-Connect007. All rights reserved.