Meet Dana Korf, I-Connect007 Columnist


Reading time ( words)

Meet Dana Korf, one of our newest I-Connect007 columnists! Dana’s columns will focus on IPC-2581 as well as PCB front-end tooling, data quality, DFM processes, etc.

Currently the principal consultant at Korf Consultancy LLC, Dana Korf works with companies to improve PCB fabricator front-end engineering processes. He also works with OEMs and ODMs to create design rules and technology roadmaps, assist with supplier selection/qualification, and reduce DFM cycles. Dana previously worked in China for over seven years at Multek in Zhuhai as senior director of manufacturing engineering and NPI and at Huawei Technologies in Shenzhen as director of PCB technology where he was responsible for PCB technology ranging from mobile phones to RF antennas, base stations, and high-speed digital servers and switches; before that, he worked for Samina-SCI, HADCO, and Zycon as director of product engineering. He has been awarded the IPC President’s Award, chaired many high-speed IPC committees, and was a co-chair for the iNEMI Data Convergence project, which has become IPC-2581. Dana graduated from Washington State University with a BSEE, and he enjoys following college and professional football and golf.

Read "Dana on Data" in Design007 Week Newsletter. Subscribe today!

Share

Print


Suggested Items

Additive Electronics Conference Set for October 2019 Debut

10/15/2019 | Kelly Dack
Kelly Dack and Tara Dunn talk about the upcoming conference "Additive Electronics: PCB Scale to IC Scale" on October 24, 2019, hosted by SMTA in San Jose, California, and why it's an important event for people to attend—especially those involved in the design process.

SMTA Additive Electronics Conference: Industry Trends

10/10/2019 | I-Connect007
Mainstream PCB manufacturing is often limited to 50-75 microns (mm) line and space. But the electronics industry is evolving quickly. Propelled by the demand for more sophisticated electronics, PCB design is being tasked with finer lines, thinner materials, and smaller via sizes.

The Institute of Circuit Technology Autumn Seminar

10/03/2019 | Pete Starkey, I-Connect007
Meriden has been established as a popular Midlands venue for Institute of Circuit Technology (ICT) meetings. On September 19, a multitude of Fellows, Members, and Associates gathered for the Institute’s autumn seminar, which was organised and hosted by ICT Technical Director Bill Wilkie. The agenda included five informative technical presentations, describing current research and development on significant topics relevant to the industry.



Copyright © 2019 I-Connect007. All rights reserved.