MacDermid Alpha to Present at IMPACT-IAAC 2019 Conference


Reading time ( words)

MacDermid Alpha Electronics Solutions will be presenting a technical paper at the IMPACT-IAAC 2019 Conference, co-located with TPCA in Taipei, to be held October 23–25, 2019. The paper details some of the ways in which MacDermid Alpha has invested in the research of innovative manufacturing processes to meet the demanding standards required for the new age of miniaturization in devices such as smartphones and high-performance computing.

Maddux Sy, Applications Manager for the Metallization group, will be presenting “Copper Electroplating Processes For Advanced HDI Applications” October 24, 14:25–14:40. The paper will be presented in Session S18, Room 504c and covers two DC acid copper micro-via fill plating processes, one for advanced tenting process (ATP) and another for modified semi additive process (mSAP) with vertical continuous plating (VCP) applications. The paper covers a broad range of topics involving the challenges presented by the advanced metallization requirements for today’s most advanced PCBs, including SL-PCB, MSAP, and traditional IC substrate designs.

Maddux will also be accepting the Packaging Best Paper Award for the paper presented at the 2018 IMPACT conference titled, “Electroplating Processes for IC Substrates-Embedded Trace Plate, Via Fill and Through-Hole Fill.”

For the times and locations for these papers and general information on the conference, please visit http://www.impact.org.tw.

For more information on Mr. Sy’s paper, contact him at Maddux.Sy@MacDermidAlpha.com

About MacDermid Alpha Electronics Solutions

Through the innovation of specialty chemicals and materials under our Alpha, Compugraphics, and MacDermid Enthone brands, MacDermid Alpha Electronics Solutions provides solutions that power electronics interconnection.  We serve all global regions and every step of device manufacturing within each segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate in design, implementation, and technical service to ensure success for our partner clients. Our solutions enable our customers’ manufacture of extraordinary electronic devices at high productivity and reduced cycle time. Find more at MacDermidAlpha.com.

Share

Print


Suggested Items

Why Designers Need to Be at the SMTA Additive Electronics Conference

10/18/2019 | I-Connect007
In a recent interview, Kelly Dack and Tara Dunn (Omni PCB president and conference co-chair) discussed why designers need to attend the SMTA Additive Electronics Conference. Tara will also be attending and moderating a panel discussion at the conference.

SMTA Additive Electronics Conference: Industry Trends

10/10/2019 | I-Connect007
Mainstream PCB manufacturing is often limited to 50-75 microns (mm) line and space. But the electronics industry is evolving quickly. Propelled by the demand for more sophisticated electronics, PCB design is being tasked with finer lines, thinner materials, and smaller via sizes.

Additive Electronics Conference Set for October 2019

09/18/2019 | I-Connect007 Editorial Team
Tara Dunn, president of Omni PCB and I-Connect007 columnist, and Lenora Clark, director of autonomous driving and safety technology at MacDermid Alpha Automotive, discuss what can be expected from the upcoming Additive Electronics Conference in San Jose, California, the impetus and motivation behind the conference, and who can benefit the most from attending.



Copyright © 2019 I-Connect007. All rights reserved.