Meet George Milad, I-Connect007 Columnist

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Meet George Milad, one of our newest I-Connect007 columnists! George’s columns will cover PCB plating, IPC specifications, and more.

George Milad has 30+ years of experience in PWB manufacturing and is the national accounts manager for technology at Uyemura International Corporation. He holds a master’s degree in physical organic chemistry from the American University in Washington, D.C., 1979, is the author of the chapters on plating and surface finishing in Printed Circuits Handbook: Seventh Edition, and has a series of publications on electrolytic plating and metallic surface finishes. George is the recipient of the 2009 IPC President’s Award, chairs the IPC Plating Committee, and is a permanent member of the IPC Technical Activities Executive Committee.

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01/27/2020 | Nolan Johnson, PCB007

Brook Sandy-Smith, IPC technical conference program manager, previews the technical side of IPC APEX EXPO 2020, which includes the customary technical sessions, but also some new wrinkles like the fundamentals program and “sessions @ the intersection” to encourage more interaction.

01/24/2020 | Nolan Johnson, PCB007

IPC’s Randy Cherry previews what to expect from IPC APEX EXPO 2020, including a full line on display demonstrating CFX/Hermes, further development of the Validation Services program, as well as testimonials from member companies that have been participating in IPC’s new trusted supplier program to the Department of Defense (DoD).

01/23/2020 | Brook Sandy-Smith, IPC

IPC's Brook Sandy-Smith brings us a preview of the Technical Conference at IPC APEX EXPO 2020. In addition to the Sessions @ the Intersection and the Technical Conference, the Fundamentals Program is new at IPC APEX EXPO 2020. The program provides curated content for industry newcomers and anyone interested in a broader view through the many facets of electronics manufacturing. Attendees will learn important concepts, terminology, and background as preparation for the detailed content on new studies and technologies presented at the technical conference.