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Meet George Milad, one of our newest I-Connect007 columnists! George’s columns will cover PCB plating, IPC specifications, and more.
George Milad has 30+ years of experience in PWB manufacturing and is the national accounts manager for technology at Uyemura International Corporation. He holds a master’s degree in physical organic chemistry from the American University in Washington, D.C., 1979, is the author of the chapters on plating and surface finishing in Printed Circuits Handbook: Seventh Edition, and has a series of publications on electrolytic plating and metallic surface finishes. George is the recipient of the 2009 IPC President’s Award, chairs the IPC Plating Committee, and is a permanent member of the IPC Technical Activities Executive Committee.
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06/29/2022 |
Pete Starkey, I-Connect007
Örebro, Sweden on June 15 brought a bright and early start to Day 2 of the EIPC Summer Conference for those who had enjoyed the previous evening’s networking dinner, but had resisted the temptation to over-indulge or to carry on their long-awaited catch-up conversations with old friends into the small hours. All but a few were in their seats for 9 a.m., awake and attentive for Session 4 of the conference, on the theme of new process technologies, moderated by Martyn Gaudion, CEO of Polar Instruments.
03/26/2021 |
Pete Starkey, I-Connect007
Bringing a specialised technical area into sharp focus, this month’s topic was “5G and the understanding of loss minimisation at the PCB level,” with papers on dielectric material, copper foil, and modelling solutions. The webinar was moderated by EIPC board member Paul Waldner managing director of Multiline International Europa, who admitted that he had managed to get a haircut especially for the occasion!
04/08/2020 |
Nikolaus Schubkegel
A circuit board is made of copper. Usually, final finishes are applied after the solder mask process. In some cases, for special applications, the final finish may be applied before solder mask. In this case, we have solder mask on ENIG or galvanic nickel-gold. It is also possible to have tin or tin-lead under solder mask; this was an old technology that no longer plays a role today.
