Atotech to Participate in Productronica and SEMICON Europa 2019

Reading time ( words)

Atotech will be exhibiting at Productronica and SEMICON Europa 2019. Visitors to these events are welcome to join the Atotech technical conference talks and meet the product and technology experts directly at the conference or at any time at the company’s booth no. 455 at productronica in Hall B3.

Atotech’s key highlights at the booth include:

  • ViaKing® – Atotech’s new enhanced graphite direct metallization for flex and advanced base materials.
  • Printoganth® P2 – Universal hor. electroless copper process for advanced base materials including 5G.
  • InPro® MVF2 – Advanced BMV filling in VCP equipment for HDI production.
  • InPro® RA – Advanced BMV filling electrolyte for bright copper deposition for flex/flex PCBs.
  • OS-Tech® – An environmentally friendly, high functioning simple process.
  • PallaBond® – Direct pure EPAG for ultra fine L/S application.
  • CupraEtch® SR8000 – Dryfilm and soldermask pretreatment with advanced adhesion performance.
  • BondFilm® EX – Bonding enhancement solution for low signal loss with high frequency applications.
  • vPlate® – Vertical continuous copper plating technology of choice for advanced HDI and IC substrate.
  • MultiPlate for FOPLP – Next generation plating system and Innolyte® process family for panel level packaging.
  • Xenolyte® Ni TR – High temperature resistant Ni for RDL and pad metallization.
  • Spherolyte® SnAg – High speed SnAg for lead free, pure and uniform solder bump plating
  • Argalin ® XL – High performance inorganic and Cr(VI)-free silver anti-tarnish
  • Stannopure PF – High speed Tin process for lead frames and connectors with perfect coverage



Suggested Items

Aurora Circuits on Ultra-Heavy Copper PCBs

08/03/2020 | Dan Beaulieu, D.B. Management Group
It’s always fun to talk with a company that can do something different—in this case, ultra-heavy copper PCBs, meaning over 20-ounce copper. Wanting to know more, Dan Beaulieu talked to Aurora Circuits Director of Business Development Thad Bartosz.

Simulation Technology in Acid Copper Pattern Plating

07/17/2020 | Pete Starkey, I-Connect007
PCB designers and CAM engineers may feel there is little they can do to achieve uniform finished copper thickness of PCB traces and holes. But in an illuminating discussion with Robrecht Belis, manager of surface finishing and e-coating with Elsyca NV in Belgium, Pete Starkey learned that nothing could be further from the truth, provided they act on time and use the right tools.

A Year in Review: Cultivate New Opportunities in Crisis, Start Fresh

07/16/2020 | I-Connect007 China Team
Recently, the China Electronic Circuit Industry Association (CPCA) invited Dr. Shiuh-Kao Chiang from Prismark to present an online video report regarding the current and future impact of the current epidemic on the global electronic circuit industry. The I-Connect007 China Team attended the presentation, and the following report summarizes some of Dr. Chiang’s remarks.

Copyright © 2020 I-Connect007. All rights reserved.