Aismalibar North America to Exhibit at Strategies in Light


Reading time ( words)

AISMALIBAR is happy to exhibit at this year’s Strategies in Light trade show in San Diego, CA on February 11−13, 2020. Strategies in Light is the leading LED and lighting event in North America and has been for more than 15 years. Aismalibar North America encourages visitors to come and view cutting-edge thermal management solutions.

Strategies in light covers every aspect of lighting to provide a 360-degree view of the market and offers a platform where professionals can learn, collaborate, and connect face-to-face. More than 200 exhibitors will showcase the latest products, technologies and services.

Aismalibar will showcase their newest technology, COBRITHERM ULTRATHIN 4W – TG180ºC−150ºC MOT. An Insulated Metal Substrate (IMS) based on an aluminum cladding with an ED copper sheet on the opposite side, it contains an innovative 35mm ultra-thin polymer-ceramic dielectric layer of its own formulation, offering industry-leading thermal conductivity and high dielectric strength. It also offers strong MOT, High Tg and Low CTE values, which are the key elements for performance of the MPCB operating at high temperatures.

In addition, Aismalibar will feature THIN LAM HTC 3,2W - Tg180°C - Td 420°C - Low CTE. By THIN LAM allows for easy temperature reduction of your board allowing for an increase the power or the processor clock speed to obtain better performance on the same electronic design. FR4 PCBs with high density of thermal vias can be replaced by a standard double side PCBs constructed with THIN LAM without the needs of thermal vias.

Finally, Aismalibar will showcase the BOND SHEET PRE PREG 3,2W - Tg180ºC - Low CTE. Aismalibar’s high thermal BOND SHEET (Thermal Pre Preg) can be used for different applications on multilayer PCB and MPCB industry. By using BOND SHEET, dielectric layers become thermally conductive and are ideal to release heat from the electronic components located on the functional copper sideways and to the heatsink.

About AISMALIBAR

Founded in 1934 and based in Barcelona, Spain, Aismalibar manufactures high end Copper and Metal Clad Laminates for the Printed Circuit Board Industry. Aismalibar’s expertise lies in offering the best solutions to reduce the operational temperature of the Printed Circuit Boards. Aismalibar materials ensure quality and reliability of all the products that incorporate them.

Aismalibar has implemented a 100% proof test with 1-3KV (High Pot Test) to every IMS laminate that is produced. These materials minimize the use of supplementary fans or heat sinks, thus reducing production costs. Aismalibar now operates globally through several subsidiaries. Our priorities are, and have always been technological innovation and customer satisfaction.

Share

Print


Suggested Items

Advantages of Using ZIF Connectors as a Termination Method

03/17/2020 | All Flex
There are many types of connectors and termination methods available when designing a flexible circuit. One of the most common is the zero insertion force (ZIF) connector. The reason why the ZIF connector is so popular is that they eliminate the requirement for an added connector. They create a direct connection from the circuit to the mating connector reducing overall weight and cost. Here are a few general facts about ZIF connectors.

Institute of Circuit Technology Spring Seminar 2020

03/11/2020 | Pete Starkey, I-Connect007
Back to Meriden, the nominal centre of England where the daffodils were blooming. A good crowd made it to the spring seminar that followed the Annual General Meeting of the Institute of Circuit Technology (ICT), with five specialist presentations and excellent opportunities to network with their peers in the industry. Pete Starkey shares his overview of the event.

2020 EIPC Winter Conference, Day 2

03/10/2020 | Pete Starkey, I-Connect007
Rested and refreshed, delegates returned to the conference room for the second day of the 2020 EIPC Winter Conference in Blijdorp, Rotterdam, South Holland. Pete Starkey provides an overview of the presentations and activities from Day 2.



Copyright © 2020 I-Connect007. All rights reserved.