-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Three Long-time IPC Volunteers Receive Dieter Bergman IPC Fellowship Award
February 11, 2020 | IPCEstimated reading time: 2 minutes
Three IPC volunteers who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts, were presented with Dieter Bergman Fellowship awards at IPC APEX EXPO 2020. Mike Carano, Bhanu Sood and Udo Welzel were chosen as award recipients because they embody the work ethic and spirit of the late Dieter Bergman, a pioneer and industry icon. They will bestow Dieter Bergman Memorial Scholarship awards on the university or college of their choice.
Mike Carano, RBP Chemical Technology, Inc., has published more than 190 technical articles and is the holder of nine U.S. and 22 international patents. An active IPC volunteer for nearly 30 years, Carano is co-chair of the IPC Technology Roadmap Executive Committee, chair of the IPC Process Effects committee and IPC Technology Solutions Committee. A frequent lecturer at IPC events, Carano also served on IPC’s Board of Directors. Carano has chosen his alma mater, Youngstown State University, Youngstown, Ohio, as recipient of the scholarship.
Bhanu Sood, Ph.D., NASA Goddard Space Flight Center, lends his expertise to nearly four dozen technical committees, including serving as chair of the D-55 Embedded Circuitry Guideline task group. He’s been an avid presenter at IPC Days in the U.K. France and the Netherlands, several consecutive high reliability forums and presented at IPC
CEMAC in Shenzhen, China, last August. He has authored several hundred conference papers, presentations and technical reports, is a member of the editorial board of SMT Journal and is an active volunteer in committees and standards development not only for IPC, but SAE and IEEE as well. Dr. Sood selected the department of aerospace engineering at the University of Petroleum and Energy Studies in Dehradun, India, as the recipient of this year’s Dieter Bergman Memorial Scholarship award.
Udo Welzel, Ph.D., Robert Bosch GmbH, is deeply involved in global standardization activities for IPC and IEC. At IPC, he serves as co-chair of the 5-21 Cold Joining Press Fit Task Group and 7-31bv IPC A-610 Automotive Addendum Task Group, along with 18 additional IPC technical committees. Dr. Welzel has chosen the Technical University (TU) in Darmstadt, Germany as recipient of the scholarship.
“The recipients of this year’s Dieter Bergman Fellowship award are leaders in the field and are making a global impact on our industry. We are indeed fortunate that they have chosen to volunteer their considerable talents and expertise with IPC and the electronics community,” said John Mitchell, IPC president and CEO.
Suggested Items
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/03/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Boeing, GKN Aerospace Close Deal for St. Louis Site
04/29/2024 | BoeingBoeing has closed a deal with GKN Aerospace St. Louis and its parent company, Melrose Industries, to continue the manufacturing of critical components that support the U.S. government and its allies.
Cicor Records Solid Growth in Q1
04/16/2024 | CicorThe Cicor Group continued to grow in the first three months of the year. Quarterly sales increased by 11.8% to CHF 107.3 million compared to the first quarter of the previous year (Q1/2023: CHF 96.0 million).
TT Electronics Awarded Contract with Kongsberg Defence and Aerospace
04/11/2024 | TT ElectronicsTT Electronics, a leading provider of global manufacturing solutions and engineered technologies, announced today that its Fairford UK business has been awarded a new contract with long-standing customer Kongsberg Defence and Aerospace (Kongsberg) for the production of complex cable harness solutions.
Cicor Successfully Completes Acquisition of TT Electronics IoT Solutions Ltd.
04/03/2024 | CicorThe Cicor Group has successfully completed the acquisition of TT Electronics IoT Solutions Ltd. with three production sites in the UK and China.