iNEMI Roadmap Series: Organic PCB

Reading time ( words)

iNEMI is hosting a series of webinars highlighting information from our 2019 Roadmap. Leaders from the chapter working groups will present relevant market trends, key applications and other factors that are driving developments, plus current and future gaps that are impacting the industry.

The Organic PCB chapter addresses the technology needs for all forms of printed circuit boards and flexible circuits. This webinar will discuss the growing complexity of components that drive the need for multilayer PCB constructions. The continuing trends for higher speed processors, coupled with technology developments such as 5G communications, will be highlighted as these require specialized materials, in particular base laminates, as well as new fabrication techniques, such as mSAP, which will also be discussed. Considerations for dense packaging of electronics, including embedding passive and active components, are covered as well as optical PCB challenges. Advanced technologies used for organic semiconductor packaging substrates will also be included as their technologies are now being adapted for advanced high-density interconnect (HDI) PCBs.

This webinar is open to anyone; advanced registration is required.

Organic PCB Roadmap - Presented by: Steve Payne (iNEMI) and Ed Kelley (Isola)
Wednesday, April 22, 2020
11:00 a.m. EDT (US)

Register for this webinar

Upcoming Webinars

Mark your calendars for the following roadmap webinars. Additional sessions will be scheduled to address other chapters and to accommodate different time zones.

Sustainable Electronics
Wednesday, April 29
11:00 a.m. EDT (US)       

Portable & Wireless
Wednesday, May 6
11:00 a.m. EDT (US)  

Smart Manufacturing
Wednesday, May 13
11:00 a.m. EDT (US)



Suggested Items

TTM on Flex and Rigid-flex PCB Challenges

03/20/2019 | Barry Matties, I-Connect007
One of the biggest bareboard manufacturers in the world, TTM Technologies has seen a recent surge in flex and rigid-flex demands from their customers. In this interview, Clay Zha, Vice President of Technology Solutions of TTM’s Mobility business unit, and VP of Corporate Marketing Winnie Ng discuss the differences in manufacturing flex versus traditional PCBs, and the increasing need for rigid-flex HDI boards.

The PCB Norsemen: The Velocity of Technology— What Does It Really Mean?

07/02/2018 | Jan Pedersen, ELMATICA
Driving a car is probably one of the areas where the user comes in direct touch with the technology development. And we understand the speed when we see how fast we get new versions of smartphones and other gadgets. But in what direction are we going?

Embedding Components, Part 1

06/30/2017 | Vern Solberg, Consultant
The printed circuit has traditionally served as the platform for mounting and interconnecting active and passive components on the outer surfaces. Companies attempting to improve functionality and minimize space are now considering embedding a broad range of these components within the circuit structure.

Copyright © 2020 I-Connect007. All rights reserved.