electronica China Will Move to a New Date in 2021


Reading time ( words)

Messe München Shanghai officially announced today that electronica China will move to a new date in 2021. The show will take place from April 14–16, 2021, at the Shanghai International Expo Centre (SNIEC). Another Messe München trade fair, productronica China will observe its original schedule and be held in March 17–19, 2021 at SNIEC.

“Thanks to the rapid development of the Chinese electronics market and the strong support from the exhibitors, electronica China, with its brand appeal and reputation, has become an important platform for technology exchange, product exhibition, and business development in the Asian electronics market. We have every reason to believe that electronica China will continue to grow in the next 20 years and stay as a strong partner of the Chinese electronics industry”, says Falk Senger, Managing Director of Messe München.

New Dates, Double Space

As its opening dates changed, more hall space will be available to the exhibitors of electronica China, thus offering an effective solution to the space shortage problem faced since 2019 show. This will also leave enough space for the expansion of new segments that reflect the new developments and trends of the industry. In addition, under the new strategy, there will be more high-quality professional visitors expected. Outdoor exhibition area will also be set for the first time. Visitors will have the opportunity to experience smart life, smart factory and smart travel in the future city.

Debut of 2021 China International Exhibition and Congress for Automotive Electronics, Systems and Solutions (eAC)

In the past 20 years, China's automotive market has gone through a series of stages: explosive growth, a temporary slowdown, rapid growth, and gradual development. Since 2020, the market has once again stood at a crossroad and encountered many difficulties and uncertainties. However, opportunities always coexist with challenges, and at the moments of crisis, the chance to clear the fog and forecast the future needs of the market will also increase. China International Exhibition and Congress for Automotive Electronics, Systems and Solutions (eAC), a new exhibition platform of Messe München, was born at just such a critical period under the expectations of the industry. Based on the advantages of electronica China, eAC features solutions through innovative exhibition forms, supporting forums and summits. With the theme of Driving Future Mobility, eAC will build a leading professional technology platform in the field of automotive electronics, systems and solutions covering new energy vehicles, intelligent network, driverless vehicles and smart travel.

More Vertical Connections for a “Model T” Exhibition

In addition to the expansion of exhibit range, electronica China will feature more solutions for application fields along the vertical industrial links. Instead of a simple venue of product exhibition, electronica China will build a platform that spans the upstream and downstream of the industry, from product design to applications implementation. The Smart Mobility Hi-Tech Park and Smart Factory Hi-Tech Park launched in 2019, as well as the IoT Hi-Tech Park in 2020 are examples of this successful application-oriented approach. They help exhibitors present their latest products, cutting-edge technologies and innovative solutions in more intuitive ways, and were well accepted by both the exhibitors and visitors. Other new trends such as 5G, smart life and smart medical will be considered in future to provide more options for exhibitors and visitors. These and other future topics like Internet of Things (IoT), 5G, artificial intelligence (AI), intelligent manufacturing, medical electronics or power electronics are also discussed by well-known experts and entrepreneurs in many forums.

Share

Print


Suggested Items

IPC: Shawn DuBravac and Chris Mitchell on USMCA

07/02/2020 | Nolan Johnson, I-Connect007
On July 1, 2020, the USMCA trade act (United States-Mexico-Canada Act) phased in as a trade agreement guiding economic trade and growth in North America. Nolan Johnson spoke with both Shawn DuBravac, IPC’s chief economist, and Chris Mitchell, IPC’s vice president of global government affairs and an I-Connect007 columnist, about the impact of USMCA on North American electronics manufacturing.

Elmatica’s Didrik Bech Accepts Role as IPC Cybersecurity Task Group Vice-Chair

06/22/2020 | Nolan Johnson, I-Connect007
On June 18, Nolan Johnson spoke with Didrik Bech, Elmatica CEO and I-Connect007 columnist, who was recently selected as vice-chair for IPC’s Cybersecurity Task Group. During their conversation, Didrik outlined the task group’s mission statement and the target audience for its work. He also shared specific examples where cybersecurity is increasingly important to the electronics manufacturing industry globally.

The iNEMI 2019 Roadmap: Flexible Hybrid Electronics

06/04/2020 | Pete Starkey, I-Connect007
The emerging trend for “electronics on everything, everything with electronics” was the theme of iNEMI’s webinar presentation of the highlights of its recently published Flexible Hybrid Electronics Roadmap Chapter, delivered by Girish Wable, senior engineering services manager with Jabil. Pete Starkey provides an overview.



Copyright © 2020 I-Connect007. All rights reserved.